参数资料
型号: WS1M32V-25G3MA
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: SRAM
英文描述: 1M X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP84
封装: 28 MM, CERAMIC, QFP-84
文件页数: 5/6页
文件大小: 309K
代理商: WS1M32V-25G3MA
WS1M32V-XG3X
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
February, 2001
Rev. 5
PRELIMINARY
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 511: 84 LEAD, CERAMIC QUAD FLAT PACK (G3)
30.23 (1.190) ± 0.25 (0.010) SQ
27.18 (1.070) ± 0.25 (0.010) SQ
1.27 (0.050)
TYP
25.40 (1.000) TYP
0.27 (0.011) ±
0.04 (0.001)
SEE DETAIL “A”
DETAIL A
1/7
29.11 (1.146) ±
0.25 (0.010)
0.19 (0.008) ±
0.06 (0.003)
0.25 (0.010) ±
0.03 (0.002)
4.29 (0.169) ±
0.28 (0.011)
4.12 (0.162) ± 0.20 (0.008)
R 0.127
(0.005) MIN
1.02 (0.040) ±
0.12 (0.005)
0.38 (0.015) ±
0.05 (0.002)
The WEDC 84 lead G3 CQFP lls the same t and
function as the JEDEC 84 lead CQFJ or 84 PLCC. But
the G3 has the TCE and lead inspection advantage of
the CQFP form.
1.146"
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