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参数资料
| 型号： | WS512K32-17G1TM |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| 封装： | 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件页数： | 4/13页 |
| 文件大小： | 485K |
| 代理商： | WS512K32-17G1TM |
12
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
WS512K32-XXX
White Electronic Designs
Document Title
512K x 32 SRAM Multi-Chip Package
Revision History
Rev # History
Release Date Status
Initial
October 1996
Preliminary
Change (Pg. 1, 3)
January 1997
Preliminary
1.1 Change Operation Supply Current from 520mA To 540mA
1.2 Change Data Retention Current from 12mA to 28mA.
Change (Pg. 1, 2, 8, 10, 11)
November 1997
Preliminary
1.1 Delete G2 Package
Change (Pg. 1, 9)
February 1998
Preliminary
1.1 Add SMD Case Outline M for G2T
Change (Pg. 1, 3, 8)
April 1998
Preliminary
1.1 Remove Low Capacitance package option
Change (Pg. 1, 6, 8)
December 1998
Preliminary
1.1 Add H1 package
Change (Pg. 1, 4, 6, 9, 10)
March 1999
Preliminary
1.1 Remove H2 package
1.2 Change logo to WEDC logo
Rev 2
Change (Pg. 1, 3, 4, 8)
May 1999
Final
1.1 Change status from Preliminary to Final
1.2 Make package descriptions consistent
1.3 Add 15ns as available in Commercial and Industrial Temperatures only.
Rev 4
Change (Pg. 1, 3)
June 1999
Final
1.1 Change Standby Current (Isb) from 60mA to 80mA Maximum
Rev 5
Change (Pg. 1, 2, 3, 4, 7, 8)
November 1999
Final
1.1 Add G1U package
Rev 6
Change (Pg. 1, 8)
February 2000
Final
1.1 Change G1U lead foot length from 0.64mm to 0.84mm Ref
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WS512K32-17G2I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS512K32-17G2LIA | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, - Bulk |
| WS512K32-17G2M | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS512K32-17G2Q | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS512K32-17G2TC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC |
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