参数资料
型号: WS512K32-55G2UC
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
封装: 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
文件页数: 10/11页
文件大小: 577K
代理商: WS512K32-55G2UC
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
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相关代理商/技术参数
参数描述
WS512K32-55G2UI 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 55NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk
WS512K32-55G2UM 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 55NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk
WS512K32-55G4TC 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC
WS512K32-55G4TCA 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module
WS512K32-55G4TI 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC