参数资料
型号: WS512K32L-25G1TIA
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
封装: 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
文件页数: 1/13页
文件大小: 485K
代理商: WS512K32L-25G1TIA
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS512K32-XXX
White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns
n Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
68 lead, 40mm Hermetic Low Profile CQFP,
3.5mm (0.140") (Package 502)1
68 lead, Hermetic CQFP (G2U), 22.4mm (0.880")
square (Package 510) 3.56mm (0.140") height.
68 lead, Hermetic CQFP (G2L), 22.4mm (0.880")
square, 5.08mm (0.200") high (Package 528).
68 lead, Hermetic CQFP (G1U)1, 23.9mm (0.940")
square (Package 519) 3.57mm (0.140") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ
footprint (Fig. 3).
68 lead, Hermetic CQFP (G1T), 23.9mm (0.940")
square (Package 524) 4.06mm (0.160") height.
FIG. 1 PIN CONFIGURATION FOR WS512K32N-XH1X
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
BLOCK DIAGRAM
n Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
n Commercial, Industrial and Military Temperature
Ranges
n TTL Compatible Inputs and Outputs
n 5 Volt Power Supply
n Low Power CMOS
n Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
n Weight
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG1UX1 - 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX1 - 20 grams typical
WS512K32-XG2LX - 8 grams typical
May 2003, Rev 12
FEATURES
*15ns Access Time available only in Commercial and Industrial
Temperature. This speed is not fully characterized and is subject to
change without notice.
Note 1: Package Not Recommended For New Design
相关PDF资料
PDF描述
WF128K32-60G2LI5 128K X 32 FLASH 5V PROM MODULE, 60 ns, CQFP68
WS128K32L-55G2LIA 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
WF2M32I-150HE5A 2M X 32 FLASH 5V PROM MODULE, 150 ns, CPGA66
W3DG647V75D2 8M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WE128K32N-250HSI 512K X 8 EEPROM 5V MODULE, 250 ns, CHIP66
相关代理商/技术参数
参数描述
WS512K32N-100HC 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk
WS512K32N-100HI 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk
WS512K32N-17H1C 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-17H1CA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-17H1I 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk