参数资料
型号: WS512K32L-25G2LCA
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
封装: 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
文件页数: 10/11页
文件大小: 577K
代理商: WS512K32L-25G2LCA
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
相关PDF资料
PDF描述
WS512K32L-20G2LQ 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
WS512K32-20G2LMA 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
WS512K32L-17H1MA 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
WS512K32N-55G2LQ 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
WS512K32N-45H1QA 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66
相关代理商/技术参数
参数描述
WS512K32N-100HC 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk
WS512K32N-100HI 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk
WS512K32N-17H1C 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-17H1CA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-17H1I 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk