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参数资料
| 型号： | WS512K32L-55H1I |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 8/11页 |
| 文件大小： | 577K |
| 代理商： | WS512K32L-55H1I |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
MAX
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not
Recommended
For New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
相关PDF资料 |
PDF描述 |
|---|---|
| WS512K32L-25G2LCA | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WS512K32L-20G2LQ | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32-20G2LMA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32L-17H1MA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS512K32N-55G2LQ | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS512K32N-100HC | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk |
| WS512K32N-100HI | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk |
| WS512K32N-17H1C | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS512K32N-17H1CA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC |
| WS512K32N-17H1I | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
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