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参数资料
| 型号： | WS512K32N-20H1C |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 1/11页 |
| 文件大小： | 577K |
| 代理商： | WS512K32N-20H1C |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
1
12
23
34
45
56
11
22
33
44
55
66
WE2#
CS2#
GND
I/O11
A10
A11
A12
VCC
CS1#
NC
I/O3
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
VCC
CS4#
WE4#
I/O27
A3
A4
A5
WE3#
CS3
GND
I/O19
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
I/O15
I/O14
I/O13
I/O12
OE#
A18
WE1#
I/O7
I/O6
I/O5
I/O4
512Kx32 SRAM MODULE, SMD 5962-94611
Access Times of 15, 17, 20, 25, 35, 45, 55ns
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
68 lead, 40mm Hermetic Low Prole CQFP,
3.5mm (0.140") (Package 502)1
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880") square (Package 510) 3.56mm
(0.140") height.
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880") square, 5.08mm (0.200") high
(Package 528).
Organized as 512Kx32, User Congurable as
1Mx16 or 2Mx8
Commercial, Industrial and Military Temperature
Ranges
FIGURE 1 – PIN CONFIGURATION FOR WS512K32N-XH1X
Pin Description
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4#
Write Enables
CS1-4#
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
WE1# CS1#
512K X 8
88
512K X 8
OE#
A0-18
I/O0 - 7
I/O8 - 15
I/O16 - 23
I/O24 - 31
WE2# CS2#WE3# CS3#WE4# CS4#
Top View
Block Diagram
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG4TX1 - 20 grams typical
WS512K32-XG2LX - 8 grams typical
* This product is subject to change without notice.
Note 1: Package Not Recommended For New Design
FEATURES
相关PDF资料 |
PDF描述 |
|---|---|
| WS512K32N-45G2UI | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68 |
| WS512K32N-35G2LIA | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WS1M32-20H2IA | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS1M32-20H2MA | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| W25Q20BWSNIP | 2M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS512K32N-20H1CA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC |
| WS512K32N-20H1I | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 20NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS512K32N-20H1IA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC |
| WS512K32N-20H1M | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 20NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS512K32N-20H1MA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC |
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