参数资料
型号: WS512K32N-20H2Q
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 2M X 8 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66
封装: 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 1/10页
文件大小: 315K
代理商: WS512K32N-20H2Q
相关PDF资料
PDF描述
WS512K32NV-120HI 512K X 32 MULTI DEVICE SRAM MODULE, 120 ns, CPGA66
WS512K32NV-120HMA 512K X 32 MULTI DEVICE SRAM MODULE, 120 ns, CPGA66
WS512K32NV-100HC 512K X 32 MULTI DEVICE SRAM MODULE, 100 ns, CPGA66
WS512K32NV-120HM 512K X 32 MULTI DEVICE SRAM MODULE, 120 ns, CPGA66
WS512K32NV-85G2TCA 512K X 32 MULTI DEVICE SRAM MODULE, 85 ns, CQFP68
相关代理商/技术参数
参数描述
WS512K32N-25H1C 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 25NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-25H1CA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-25H1I 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 25NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-25H1IA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-25H1M 制造商:White Electronic Designs 功能描述:Conn Terminal Block 3 POS 5.08mm Solder ST Thru-Hole 13.5A 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 25NS, NO CONNECT, 66 PGA 1.075" S - Bulk