参数资料
型号: WS512K32N-25H2IA
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
封装: 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 1/10页
文件大小: 315K
代理商: WS512K32N-25H2IA
相关PDF资料
PDF描述
WS512K32N-35H2CA 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66
WS512K32N-55H2Q 2M X 8 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66
WS512K32N-35H2IA 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CHMA66
WS512K32N-17H2Q 2M X 8 MULTI DEVICE SRAM MODULE, 17 ns, CHMA66
WS512K32N-17H2I 2M X 8 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
相关代理商/技术参数
参数描述
WS512K32N-35H1C 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 35NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-35H1CA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-35H1I 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 35NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-35H1IA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-35H1M 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 35NS, NO CONNECT, 66 PGA 1.075" S - Bulk