参数资料
型号: WS512K32V-17G2UM
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
封装: 22.40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
文件页数: 6/7页
文件大小: 292K
代理商: WS512K32V-17G2UM
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS512K32V-XXX
March
2006
Rev. 12
27.3 (1.075) ± 0.25 (0.010) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
0.46 (0.018) ± 0.05 (0.002) DIA
1.42 (0.056) ± 0.13 (0.005)
0.76 (0.030) ± 0.13 (0.005)
1.27 (0.050) TYP DIA
25.4 (1.0) TYP
15.24 (0.600) TYP
2.54 (0.100)
TYP
3.81 (0.150)
± 0.13 (0.005)
4.60 (0.181)
MAX
PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015) ± 0.05 (0.002)
0.25 (0.010) ± 0.10 (0.002)
25.15 (0.990) ± 0.25 (0.010) SQ
1.27 (0.050) TYP
24.0 (0.946)
± 0.25 (0.010)
22.36 (0.880) ± 0.25 (0.010) SQ
20.3 (0.800) REF
23.87
(0.940) REF
1.01 (0.040)
± 0.13 (0.005)
0.25 (0.010) REF
1° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
0.53 (0.021)
± 0.18 (0.007)
3.51 (0.140) MAX
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
相关PDF资料
PDF描述
WS-128K32-100G4C 512K X 8 MULTI DEVICE SRAM MODULE, 100 ns, CQFP68
WS-128K32-120G4C 512K X 8 MULTI DEVICE SRAM MODULE, 120 ns, CQFP68
WF128K32A-150HC 512K X 8 FLASH 12V PROM MODULE, 150 ns, CHIP66
WPF1M32P-90LSC5T 1M X 32 FLASH 5V PROM MODULE, 90 ns, PSMA80
WS57C040F-55DI 512K X 8 UVPROM, 55 ns, CDIP32
相关代理商/技术参数
参数描述
WS512K32V-17H1C 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE
WS512K32V-17H1CA 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE
WS512K32V-17H1I 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE
WS512K32V-17H1IA 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE
WS512K32V-17H1M 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE