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参数资料
| 型号： | WS512K32V-20G2TIA |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQMA68 |
| 封装： | 22.40 MM, CERAMIC, LQFP-68 |
| 文件页数： | 1/8页 |
| 文件大小： | 245K |
| 代理商： | WS512K32V-20G2TIA |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32V-XXX
512Kx32 SRAM 3.3V MULTICHIP PACKAGE
n Low Voltage Operation:
3.3V ± 10% Power Supply
n Low Power CMOS
n TTL Compatible Inputs and Outputs
n Fully Static Operation:
No clock or refresh required.
n Three State Output.
n Built-in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
n Weight
WS512K32V-XG1UX - 5 grams typical
WS512K32V-XG2TX1 - 8 grams typical
WS512K32NV-XH1X - 13 grams typical
Note 1: Package Not Recommended For New Design
*This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
FEATURES
n Access Times of 15, 17, 20ns
n Low Voltage Operation
n Packaging
66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
68 lead, 22.4mm (0.880 inch) CQFP, (G2T)1, 4.6mm
(0.180"), (Package 509)
68 lead, 23.9mm (0.940 inch) sq., Low Profile CQFP,
(G1U), 3.56mm (0.140 inch) high, (Package 519)
n Organized as 512Kx32; User Configurable as 1Mx16 or
2Mx8
n Commercial, Industrial and Military Temperature Ranges
PIN CONFIGURATION FOR WS512K32NV-XH1X
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
BLOCK DIAGRAM
July 2002 Rev. 7
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A18
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A3
A4
A5
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
PRELIMINARY*
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| WS512K32V-20G2TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQMA68 |
| WS512K32V-17G2TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQMA68 |
| WS512K48-20G4WM | 512K X 48 MULTI DEVICE SRAM MODULE, 20 ns, CQFP116 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WS512K32V-20G2TM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-20G2TMA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-20G2UC | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 20NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS512K32V-20G2UI | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 20NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS512K32V-20G2UIA | 制造商:White Electronic Designs 功能描述:SRAM Module Asynchronous 16Mbit |
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