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参数资料
| 型号： | WSF512K32-27H2M |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, CPGA66 |
| 封装： | 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 1/14页 |
| 文件大小： | 261K |
| 代理商： | WSF512K32-27H2M |
HI-RELIABILITY PRODUCT
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
512KX32 SRAM / FLASH MODULE PRELIMINARY*
FLASH MEMORY FEATURES
s 100,000 Erase/Program Cycles
s Sector Architecture
8 equal size sectors of 64KBytes each
Any combination of sectors can be concurrently erased.
Also supports full chip erase
s 5 Volt Programming; 5V
± 10% Supply
s Embedded Erase and Program Algorithms
s Hardware Write Protection
s Page Program Operation and Internal Program Control Time.
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
Note: Programming information available upon request.
FIG. 1 PIN CONFIGURATION FOR WSF512K32-XH2X
BLOCK DIAGRAM
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
SWE1-4
SRAM Write Enables
SCS
SRAM Chip Select
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
FWE1-4
Flash Write Enables
FCS
Flash Chip Select
OE
FCS
SCS
A0-18
FWE 1
SWE 1
512K x 8 Flash
512K x 8 SRAM
I/O0-7
FWE 2
SWE 2
512K x 8 Flash
512K x 8 SRAM
I/O8-15
FWE 3
SWE 3
512K x 8 Flash
512K x 8 SRAM
I/O16-23
FWE 4
SWE 4
512K x 8 Flash
512K x 8 SRAM
I/O24-31
FEATURES
s Access Times of 25ns (SRAM) and 70, 90ns (FLASH)
s Packaging
66 pin, PGA Type, 1.385" square HIP, Hermetic Ceramic
HIP (Package 402)
68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square
(Package 509) 4.57mm (0.180") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (Fig. 2). Package to
be developed.
s 512Kx32 SRAM
s 512Kx32 5V Flash
s Organized as 512Kx32 of SRAM and 512Kx32 of Flash
Memory with common Data Bus
s Low Power CMOS
s Commercial, Industrial and Military Temperature Ranges
s TTL Compatible Inputs and Outputs
s Built in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
s Weight - 13 grams typical
June 2001 Rev. 6
TOP VIEW
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
FWE2
SWE2
GND
I/O11
A10
A9
A15
VCC
FCS
SCS
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A17
FWE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
SWE1
A13
A8
I/O16
I/O17
I/O18
VCC
SWE4
FWE4
I/O27
A4
A5
A6
FWE3
SWE3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
WSF512K32-XXX
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WSF512K32-29G2TC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512KX32 SRAM / FLASH MODULE |
| WSF512K32-29G2TCA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512KX32 SRAM / FLASH MODULE |
| WSF512K32-29G2TI | 制造商:Microsemi Corporation 功能描述:512K X 16 MIXED MODULE, 5V, - Bulk 制造商:White Electronic Designs 功能描述:512K X 16 MIXED MODULE, 5V, - Bulk |
| WSF512K32-29G2TIA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512KX32 SRAM / FLASH MODULE |
| WSF512K32-29G2TM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512KX32 SRAM / FLASH MODULE |
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