参数资料
型号: X1226S8
厂商: Intersil
文件页数: 16/25页
文件大小: 0K
描述: IC RTC CLNDR OUTFREQ 4K EE 8SOIC
标准包装: 100
类型: 时钟/日历
特点: 警报器,闰年
时间格式: HH:MM:SS(12/24 小时)
数据格式: YY-MM-DD-dd
接口: I²C,2 线串口
电源电压: 2.7 V ~ 5.5 V
电压 - 电源,电池: 1.8 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
23
FN8098.3
May 8, 2006
Referring to Figure 16, Vtrip applies to the “Internal
Vcc” node which powers the entire device. This means
that if Vcc is powered down and the battery voltage at
Vback is higher than the Vtrip voltage, then the entire
chip will be running from the battery. If Vback falls to
lower than Vtrip, then the chip shuts down and all out-
puts are disabled except for the oscillator and time-
keeping circuitry. The fact that the chip can be
powered from Vback is not necessarily an issue since
standby current for the RTC devices is <2A for this
mode (called “main timekeeping current” in the data
sheet). Only when the serial interface is active is there
an increase in supply current, and with Vcc powered
down, the serial interface will most likely be inactive.
One way to prevent operation in battery backup mode
above the Vtrip level is to add a diode drop (silicon
diode preferred) to the battery to insure it is below
Vtrip. This will also provide reverse leakage protection
which may be needed to get safety agency approval.
One mode that should always be avoided is the oper-
ation of the RTC device with Vback greater than both
Vcc and Vtrip (Condition 2d in Table 8). This will
cause the battery to drain quickly as serial bus com-
munication and non-volatile writes will require higher
supplier current.
PERFORMANCE DATA
IBACK Performance
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
IBACK vs. Temperature
Multi-Lot Process Variation Data
Temperature °C
-40
25
60
85
I BACK
(
A)
3.3V
1.8V
X1226
相关PDF资料
PDF描述
MCP4141-103E/MS IC POT DGTL SNGL 10K SPI 8MSOP
MCP4141-103E/MF IC POT DGTL SNGL 10K SPI 8DFN
MS3456W14S-6P CONN PLUG 6POS STRAIGHT W/PINS
VI-BNZ-MY-F4 CONVERTER MOD DC/DC 2V 20W
VE-B5D-MV CONVERTER MOD DC/DC 85V 150W
相关代理商/技术参数
参数描述
X1226S8I 功能描述:IC RTC/CALENDAR/4K EE 8-SOIC RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器,闰年,SRAM 存储容量:- 时间格式:HH:MM:SS(12/24 小时) 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源,电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件
X1226S8IT1 功能描述:IC RTC/CALENDAR/4K EE 8-SOIC RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器,闰年,SRAM 存储容量:- 时间格式:HH:MM:SS(12/24 小时) 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源,电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件
X1226S8IZ 功能描述:IC RTC/CALENDAR/ALARM 4K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器,闰年,SRAM 存储容量:- 时间格式:HH:MM:SS(12/24 小时) 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源,电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件
X1226S8IZT1 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Real Time Clock/Calendar with EEPROM
X1226S8T1 功能描述:IC RTC/CALENDAR/4K EE 8-SOIC RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器,闰年,SRAM 存储容量:- 时间格式:HH:MM:SS(12/24 小时) 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源,电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件