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参数资料
| 型号： | X3C07P1-03S |
| 厂商： | Anaren |
| 文件页数： | 13/25页 |
| 文件大小： | 0K |
| 描述： | COUPLER 90DEG 600-900MHZ 3DB |
| 标准包装： | 1 |
| 系列： | Xinger III® |
| 耦合器类型： | 标准 |
| 频率： | * |
| 耦合系数： | 3dB |
| 应用： | 通用 |
| 插入损耗： | 0.17dB |
| 功率 - 最大： | 130W |
| 隔离： | 25dB |
| 封装/外壳： | 2520（6450 公制） |
| 供应商设备封装： | 4-SMD |
| 包装： | 标准包装 |
| 其它名称： | 1173-1103-6 |
`
Model X3C07P1-03S
Rev C
IL therm ? 10 ? log 10 ?
? P
?
?
?
? out ( CPL )
P in
? P out ( DC ) ? P out ( ISO ) ? P out ( RL ) ? ?
( dB )
(4)
In terms of S-parameters, IL therm can be computed as follows:
IL therm ? ? 10 ? log 10 ? ? S 11 ? S 21 ? S 31 ? S 41
?
?
2 2 2
2 ?
?
( dB )
(5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (P in ) therefore is:
? T
?
? 1 ? 10
?
?
?
?
? 1 ? 10
?
?
?
P in ?
?
P dis
? IL therm
10
?
?
?
?
R
? IL therm
10
?
?
( W )
(6)
Where the temperature delta is the circuit temperature (T circ ) minus the mounting interface temperature (T mnt ):
? T ? T circ ? T mnt
( o C )
(7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger III product family to optimize RF
performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger III coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
相关PDF资料 |
PDF描述 |
|---|---|
| X3C09E2-20S | COUPLER 90DEG 800-1000MHZ 20DB |
| X3C09P1-03S | COUPLER 90DEG 800-1000MHZ 3DB |
| X3C09P2-03S | COUPLER 90DEG 800-1000MHZ 3DB |
| X3C09P2-30S | COUPLER 90DEG 800-1000MHZ 30DB |
| X3C19E2-20S | COUPLER 90DEG 1700-2000MHZ 20DB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X3C07P1-03S-CT | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C07P1-03S-R | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C07P1-05S | 制造商:Anaren Microwave 功能描述:DIRECTIONAL COUPLER 制造商:Anaren Microwave 功能描述:A LOW PROFILE, HIGH PERFORMANCE 5DB DIRECTIONAL COUPLER |
| X3C07P1-05S-CT | 制造商:Anaren Microwave 功能描述:RF DIRECTIONAL COUPLER |
| X3C07P1-05S-R | 制造商:Anaren Microwave 功能描述:RF DIRECTIONAL COUPLER |
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