参数资料
型号: X3C09E2-20S
厂商: Anaren
文件页数: 15/22页
文件大小: 0K
描述: COUPLER 90DEG 800-1000MHZ 20DB
标准包装: 1
系列: Xinger III®
耦合器类型: 标准
频率: 700MHz ~ 1GHz
耦合系数: 20dB
应用: AMPS,CDMA,WCDMA
插入损耗: 0.05dB
功率 - 最大: 225W
隔离: 43dB
回程损耗: 20dB
封装/外壳: 4-SMD,无引线
供应商设备封装: 4-SMD
包装: 标准包装
其它名称: 1173-1104-6
Model X3C09E2-20
Rev A
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.35 gram
coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
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