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参数资料
| 型号： | X3C19P1-03S |
| 厂商： | Anaren |
| 文件页数： | 11/25页 |
| 文件大小： | 0K |
| 描述： | COUPLER 90DEG 1700-2000MHZ 3DB |
| 标准包装： | 1 |
| 系列： | Xinger III® |
| 耦合器类型： | 标准 |
| 频率： | 1.4GHz ~ 2GHz |
| 耦合系数： | 3dB |
| 应用： | DCS，LTE，PCS，WCDMA |
| 插入损耗： | 0.22dB |
| 功率 - 最大： | 110W |
| 隔离： | 25dB |
| 回程损耗： | 17.68dB |
| 封装/外壳： | 2520（6450 公制） |
| 供应商设备封装： | SMD |
| 包装： | 标准包装 |
| 其它名称： | 1173-1109-6 |
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Model X3C19P1-03S
Rev D
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
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Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
Maximum mounting interface temperature is 95 C.
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The unit has reached a steady state operating condition.
o
Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
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Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta ( Δ T) divided by thermal resistance (R). The
dissipated power (P dis ) can also be calculated as a function of the total input power (P in ) and the thermal insertion loss
(IL therm ):
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= P in ? ? ? 1 ? 10 10
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P dis =
Δ T
R
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? IL therm
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( W )
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
相关PDF资料 |
PDF描述 |
|---|---|
| X3C19P2-03S | COUPLER 90DEG 1700-2000MHZ 3DB |
| X3C19P2-30S | COUPLER 90DEG 1700-2000MHZ 30DB |
| X3C21P1-03S | COUPLER 90DEG 2000-2300MHZ 3DB |
| X3C21P2-03S | COUPLER 90DEG 2000-2300MHZ 3DB |
| X3C26P1-03S | COUPLER 90DEG 2650-2800MHZ 3DB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X3C19P1-03S-CT | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C19P1-03S-R | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C19P1-05S | 功能描述:信号调节 1700-2000MHz IL.15dB VSWR:1.22 -55 to 95C RoHS:否 制造商:EPCOS 产品:Duplexers 频率:782 MHz, 751 MHz 频率范围: 电压额定值: 带宽: 阻抗:50 Ohms 端接类型:SMD/SMT 封装 / 箱体:2.5 mm x 2 mm 工作温度范围:- 30 C to + 85 C 封装:Reel |
| X3C19P1-05S-CT | 制造商:Anaren Microwave 功能描述:RF DIRECTIONAL COUPLER |
| X3C19P1-05S-R | 制造商:Anaren Microwave 功能描述:RF DIRECTIONAL COUPLER |
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