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参数资料
| 型号： | X3C21P2-03S |
| 厂商： | Anaren |
| 文件页数： | 13/22页 |
| 文件大小： | 0K |
| 描述： | COUPLER 90DEG 2000-2300MHZ 3DB |
| 标准包装： | 1 |
| 系列： | Xinger III® |
| 耦合器类型： | 标准 |
| 频率： | 800MHz ~ 1GHz |
| 耦合系数： | 30dB |
| 应用： | 通用 |
| 插入损耗： | 0.1dB |
| 功率 - 最大： | 225W |
| 回程损耗： | 23dB |
| 封装/外壳： | * |
| 供应商设备封装： | * |
| 包装： | * |
| 其它名称： | 1173-1113-6 |
Model X3C09P2-30S
Rev B
IL therm ? 10 ? log 10 ?
? P
?
?
?
? out ( CPL )
P in
? P out ( DC ) ? P out ( ISO ) ? P out ( RL ) ? ?
( dB )
(4)
In terms of S-parameters, IL therm can be computed as follows:
IL therm ? ? 10 ? log 10 ? ? S 11 ? S 21 ? S 31 ? S 41
?
?
2 2 2
2 ?
?
( dB )
(5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (P in ) therefore is:
? T
?
? 1 ? 10
?
?
?
?
? 1 ? 10
?
?
?
P in ?
?
P dis
? IL therm
10
?
?
?
?
R
? IL therm
10
?
?
( W )
(6)
Where the temperature delta is the circuit temperature (T circ ) minus the mounting interface temperature (T mnt ):
? T ? T circ ? T mnt
( o C )
(7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger III product family to optimize RF
performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger III coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
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| X3C26P1-30S | COUPLER 90DEG 2650-2800MHZ 30DB |
| X3DC07E2S | DOHERTY COMBINER 728-768MHZ SMD |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| X3C25F1-03S-CT | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C25F1-03S-R | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C25F1-03S-R5 | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C25P1-05S | 功能描述:信号调节 2300-2700MHz IL.18dB VSWR:1.22 -55 to 95C RoHS:否 制造商:EPCOS 产品:Duplexers 频率:782 MHz, 751 MHz 频率范围: 电压额定值: 带宽: 阻抗:50 Ohms 端接类型:SMD/SMT 封装 / 箱体:2.5 mm x 2 mm 工作温度范围:- 30 C to + 85 C 封装:Reel |
| X3C25P1-05S-CT | 制造商:Anaren Microwave 功能描述:RF DIRECTIONAL COUPLER |
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