参数资料
型号: X40035S14-B
厂商: Intersil
文件页数: 23/23页
文件大小: 0K
描述: IC VOLTAGE MONITOR TRPL 14-SOIC
标准包装: 50
类型: 多压监控器
监视电压数目: 3
输出: 开路漏极或开路集电极
复位: 低有效
复位超时: 可调节/可选择
电压 - 阀值: 1.3V,2.9V,4.6V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
供应商设备封装: 14-SOICN
包装: 管件
X40030, X40031, X40034, X40035
Thin Shrink Small Outline Package Family (TSSOP)
0.25 M C A B
N
D
(N/2)+1
A
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
MILLIMETERS
E
E1
PIN #1 I.D.
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
A 1.20 1.20 1.20 1.20 1.20 Max
A1
A2
0.10
0.90
0.10
0.90
0.10
0.90
0.10
0.90
0.10
0.90
±0.05
±0.05
B
1
TOP VIEW
(N/2)
0.20 C B A
2X
N/2 LEAD TIPS
b
c
0.25
0.15
0.25
0.15
0.25
0.15
0.25
0.15
0.25
0.15
+0.05/-0.06
+0.05/-0.06
D
E
E1
5.00
6.40
4.40
5.00
6.40
4.40
6.50
6.40
4.40
7.80
6.40
4.40
9.70
6.40
4.40
±0.10
Basic
±0.10
C
e
0.05
H
e
L
0.65
0.60
0.65
0.60
0.65
0.60
0.65
0.60
0.65
0.60
Basic
±0.15
SEATING
L1
1.00
1.00
1.00
1.00
1.00
Reference
PLANE
0.10 C
N LEADS
b
SIDE VIEW
0.10 M C A B
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
SEE DETAIL “X”
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M - 1994.
c
END VIEW
L1
A
A2
GAUGE
PLANE
0.25
A1
L
0° - 8°
DETAIL X
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
23
FN8114.2
August 25, 2008
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