参数资料
| 型号： | X5325V14I-2.7T1 |
| 厂商： | Intersil |
| 文件页数： | 3/20页 |
| 文件大小： | 0K |
| 描述： | IC SUPERVISOR CPU 32K EE 14TSSOP |
| 标准包装： | 2,500 |
| 类型： | 简单复位/加电复位 |
| 监视电压数目： | 1 |
| 输出： | 开路漏极或开路集电极 |
| 复位： | 高有效 |
| 复位超时： | 最小为 100 ms |
| 电压 - 阀值： | 2.63V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 14-TSSOP |
| 包装： | 带卷 (TR) |
X5323, X5325
Ordering Information (Continued)
PART NUMBER
PART NUMBER
RESET
PART
RESET
PART
V CC RANGE
TEMP
(ACTIVE LOW)
MARKING
(ACTIVE HIGH)
MARKING
(V) V TRIP RANGE RANGE (°C)
PACKAGE
X5323V14-2.7A
X5323 VAN
X5325V14-2.7A
X5325 VAN
2.7 to 5.5
2.85 to 3.0
0 to +70
14 Ld TSSOP
X5323V14Z-2.7A
(Note)
X5323 VZAN X5325V14Z-2.7A
(Note)
X5325 VZAN
0 to +70
14 Ld TSSOP
(Pb-free)
X5323V14I-2.7A
X5323 VAP
X5325V14I-2.7A
X5325 VAP
-40 to +85
14 Ld TSSOP
X5323V14IZ-2.7A
(Note)
X5323 VZAP X5325V14IZ-2.7A
(Note)
X5325 VZAP
-40 to +85
14 Ld TSSOP
(Pb-free)
X5323P-2.7
X5323PZ-2.7 (Note)
X5323PI-2.7
X5323PIZ-2.7 (Note)
X5323S8-2.7*
X5323P F
X5323P ZF
X5323P G
X5323P ZG
X5323 F
X5325P-2.7
X5325PZ-2.7
X5325PI-2.7
X5325PIZ-2.7
X5325S8-2.7*
X5325P F
X5325P ZF
X5325P G
X5325P ZG
X5325 F
2.7 to 5.5
2.55 to 2.7
0 to +70
0 to +70
-40 to +85
-40 to +85
0 to +70
8 Ld PDIP
8 Ld PDIP** (Pb-free)
8 Ld PDIP
8 Ld PDIP** (Pb-free)
8 Ld SOIC
X5323S8Z-2.7* (Note) X5323 ZF
X5325S8Z-2.7* (Note) X5325 ZF
0 to +70
8 Ld SOIC (Pb-free)
X5323S8I-2.7*
X5323 G
X5325S8I-2.7*
X5325 G
-40 to +85
8 Ld SOIC
X5323S8IZ-2.7* (Note) X5323 ZG
X5325S8IZ-2.7* (Note) X5325 ZG
-40 to +85
8 Ld SOIC (Pb-free)
X5323V14-2.7*
X5323V14Z-2.7*
X5323 VF
X5323 VZF
X5325V14-2.7*
X5325V14Z-2.7*
X5325 VF
X5325 VZF
0 to +70
0 to +70
14 Ld TSSOP
14 Ld TSSOP
(Note)
(Note)
(Pb-free)
X5323V14I-2.7*
X5323V14IZ-2.7*
X5323 VG
X5323 VZG
X5325V14I-2.7*
X5325V14IZ-2.7*
X5325 VG
X5325 VZG
-40 to +85
-40 to +85
14 Ld TSSOP
14 Ld TSSOP
(Note)
(Note)
(Pb-free)
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.
Pinouts
X5323, X5325
(8 LD SOIC, PDIP)
TOP VIEW
X5323, X5325
(14 LD TSSOP)
TOP VIEW
CS/WDI
SO
WP
V SS
1
2
3
4
8
7
6
5
V CC
RESET/RESET
SCK
SI
CS/WDI
SO
NC
NC
NC
1
2
3
4
5
14
13
12
11
10
V CC
RESET/RESET
NC
NC
NC
3
WP
V SS
6
7
9
8
SCK
SI
FN8131.2
June 30, 2008
相关PDF资料 |
PDF描述 |
|---|---|
| HBC28DRYI | CONN EDGECARD 56POS DIP .100 SLD |
| X5325V14I-2.7A | IC SUPERVISOR CPU 32K EE 14TSSOP |
| TC2186-3.3VCTTR | IC REG LDO 3.3V .15A SOT23A-5 |
| HSC20DRYH | CONN EDGECARD 40POS DIP .100 SLD |
| X5325V14I-2.7 | IC SUPERVISOR CPU 32K EE 14TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X5325V14I-4.5A | 功能描述:IC SUPERVISOR CPU 32K EE 14TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 监控器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:简单复位/加电复位 监视电压数目:1 输出:推挽式，图腾柱 复位:低有效 复位超时:最小 145 ms 电压 - 阀值:2.64V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-WQFN 裸露焊盘 供应商设备封装:16-TQFN-EP（4x4） 包装:带卷 (TR) |
| X5325V14IT1 | 功能描述:IC SUPERVISOR CPU 32K EE 14TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 监控器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:简单复位/加电复位 监视电压数目:1 输出:推挽式，图腾柱 复位:低有效 复位超时:最小 145 ms 电压 - 阀值:2.64V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-WQFN 裸露焊盘 供应商设备封装:16-TQFN-EP（4x4） 包装:带卷 (TR) |
| X5325V14IZ | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:CPU Supervisor with 32Kb SPI EEPROM |
| X5325V14IZ-2.7 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:CPU Supervisor with 32Kb SPI EEPROM |
| X5325V14IZ-2.7A | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:CPU Supervisor with 32Kb SPI EEPROM |
发布紧急采购，3分钟左右您将得到回复。