参数资料
| 型号： | X9015WS8Z-2.7 |
| 厂商： | Intersil |
| 文件页数： | 2/11页 |
| 文件大小： | 0K |
| 描述： | IC XDCP SGL 32-TAP 10K 8-SOIC |
| 标准包装： | 100 |
| 系列： | XDCP™ |
| 接片： | 128 |
| 电阻（欧姆）： | 10k |
| 电路数： | 1 |
| 温度系数： | 标准值 ±300 ppm/°C |
| 存储器类型： | 易失 |
| 接口： | 3 线串行（芯片选择，递增，增/减） |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
10
FN8157.5
August 31, 2006
X9015
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
相关PDF资料 |
PDF描述 |
|---|---|
| MS27467T25F29PD | CONN PLUG 29POS STRAIGHT W/PINS |
| DS1040Z-A15 | IC DELAY LINE 5TAP 15NS 8-SOIC |
| MS27473E24A61SB | CONN PLUG 61POS STRAIGHT W/SCKT |
| X9015US8Z | IC XDCP SGL 32-TAP 50K 8-SOIC |
| X9015US8IZ-2.7 | IC XDCP SGL 32-TAP 50K 8-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X9015WS8ZT1 | 功能描述:IC XDCP SGL 32-TAP 10K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
| X90840 WAF | 制造商:Intersil Corporation 功能描述: |
| X90A104K | 制造商: 功能描述: 制造商:MEPCO/CENTRALAB A NORTH A 功能描述: 制造商:undefined 功能描述: |
| X9110 | 制造商:XICOR 制造商全称:Xicor Inc. 功能描述:Single Digitally-Controlled (XDCP) Potentiometer |
| X9110_08 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Dual Supply/Low Power/1024-Tap/SPI Bus |
发布紧急采购，3分钟左右您将得到回复。