参数资料
型号: X9259UV24Z-2.7
厂商: Intersil
文件页数: 12/21页
文件大小: 0K
描述: IC XDCP QUAD 256TAP 50K 24-TSSOP
标准包装: 62
系列: XDCP™
接片: 256
电阻(欧姆): 50k
电路数: 4
温度系数: 标准值 ±300 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 2.7 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 24-TSSOP
包装: 管件
2
FN8169.5
April 13, 2007
Ordering Information
PART
NUMBER
PART MARKING
VCC LIMITS
(V)
RTOTAL
(k
Ω)
TEMPERATURE
RANGE
(°C)
PACKAGE
PKG. DWG. #
X9259TS24
X9259TS
5 ±10%
100
0 to +70
24 Ld SOIC
M24.3
X9259TS24Z (Note)
X9259TS Z
0 to +70
24 Ld SOIC (Pb-free)
M24.3
X9259TS24I
X9259TS I
-40 to +85
24 Ld SOIC
M24.3
X9259TS24IZ (Note)
X9259TS ZI
-40 to +85
24 Ld SOIC (Pb-free)
M24.3
X9259TV24I
X9259TV I
-40 to +85
24 Ld TSSOP
MDP0044
X9259TV24IZ (Note)
X9259TV ZI
-40 to +85
24 Ld TSSOP (Pb-free)
MDP0044
X9259US24*
X9259US
50
0 to +70
24 Ld SOIC
M24.3
X9259US24Z* (Note)
X9259US Z
0 to +70
24 Ld SOIC (Pb-free)
M24.3
X9259US24I
X9259US I
-40 to +85
24 Ld SOIC
M24.3
X9259US24IZ (Note)
X9259US ZI
-40 to +85
24 Ld SOIC (Pb-free)
M24.3
X9259UV24I*
X9259UV I
-40 to +85
24 Ld TSSOP
MDP0044
X9259UV24IZ* (Note)
X9259UV Z I
-40 to +85
24 Ld TSSOP (Pb-free)
MDP0044
X9259TS24-2.7*
X9259TS F
2.7 to 5.5
100
0 to +70
24 Ld SOIC
M24.3
X9259TS24Z-2.7* (Note)
X9259TS ZF
0 to +70
24 Ld SOIC (Pb-free)
M24.3
X9259TS24I-2.7
X9259TS G
-40 to +85
24 Ld SOIC
M24.3
X9259TS24IZ-2.7 (Note)
X9259TS ZG
-40 to +85
24 Ld SOIC (Pb-free)
M24.3
X9259TV24-2.7
X9259TV F
0 to +70
24 Ld TSSOP
MDP0044
X9259TV24Z-2.7 (Note)
X9259TV ZF
0 to +70
24 Ld TSSOP (Pb-free)
MDP0044
X9259US24-2.7
X9259US F
50
0 to +70
24 Ld SOIC
M24.3
X9259US24Z-2.7 (Note)
X9259US ZF
0 to +70
24 Ld SOIC (Pb-free)
M24.3
X9259US24I-2.7
X9259US G
-40 to +85
24 Ld SOIC
M24.3
X9259US24IZ-2.7 (Note)
X9259US ZG
-40 to +85
24 Ld SOIC (Pb-free)
M24.3
X9259UV24-2.7*
X9259UV F
0 to +70
24 Ld TSSOP
MDP0044
X9259UV24Z-2.7 (Note)
X9259UV ZF
0 to +70
24 Ld TSSOP (Pb-free)
MDP0044
X9259UV24I-2.7*
X9259UV G
-40 to +85
24 Ld TSSOP
MDP0044
X9259UV24IZ-2.7* (Note)
X9259UV ZG
-40 to +85
24 Ld TSSOP (Pb-free)
MDP0044
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
*Add "T1" suffix for tape and reel.
X9259
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