参数资料
型号: X9313UMZ-3
厂商: Intersil
文件页数: 12/12页
文件大小: 0K
描述: IC XDCP 32-TAP 50K 3-WIRE 8-MSOP
标准包装: 80
系列: XDCP™
接片: 32
电阻(欧姆): 50k
电路数: 1
温度系数: 标准值 ±300 ppm/°C
存储器类型: 非易失
接口: 3 线串行(芯片选择,递增,增/减)
电源电压: 3 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 管件
9
FN8177.6
January 15, 2008
X9313
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
12
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C D
E1
CL
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N8
8
7
R
0.003
-
0.07
-
R1
0.003
-
0.07
-
05o
15o
5o
15o
-
α
0o
6o
0o
6o
-
Rev. 2 01/03
相关PDF资料
PDF描述
X9C103SIZT2 IC XDCP 100-TAP 10K EE 8-SOIC
ISL22414WFU10Z-T7A IC DGTL POT 256POS 10K 10MSOP
X9460KV14IZ-2.7 IC XDCP DUAL AUD 32T 33K 14TSSOP
X9460KV14IZ IC XDCP DUAL AUD 32T 33K 14TSSOP
X9313ZPIZ IC XDCP 3-WIRE 32-TAP 10K 8-PDIP
相关代理商/技术参数
参数描述
X9313UMZ-3T1 功能描述:IC XDCP 32-TAP 50K 3-WIRE 8-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻(欧姆):100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行(芯片选择,递增,增/减) 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR)
X9313UMZT1 功能描述:IC XDCP 32-TAP 50K 3-WIRE 8-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻(欧姆):100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行(芯片选择,递增,增/减) 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR)
X9313UP 功能描述:IC XDCP 32-TAP 50K 3-WIRE 8-DIP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻(欧姆):50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型,TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR)
X9313UP3 制造商:XICOR 制造商全称:Xicor Inc. 功能描述:E2POT⑩ Nonvolatile Digital Potentiometer
X9313UP-3 功能描述:IC XDCP 32-TAP 50K 3-WIRE 8-DIP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻(欧姆):50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型,TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR)