参数资料
| 型号： | X9313WSZ-3 |
| 厂商： | Intersil |
| 文件页数： | 4/12页 |
| 文件大小： | 0K |
| 描述： | IC XDCP 32-TAP 10K 3-WIRE 8-SOIC |
| 标准包装： | 100 |
| 系列： | XDCP™ |
| 接片： | 32 |
| 电阻（欧姆）： | 10k |
| 电路数： | 1 |
| 温度系数： | 标准值 ±300 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | 3 线串行（芯片选择，递增，增/减） |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
12
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8177.6
January 15, 2008
X9313
Plastic Dual-In-Line Packages (PDIP)
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
SYMBOL
INCHES
TOLERANCE
NOTES
PDIP8
PDIP14
PDIP16
PDIP18
PDIP20
A
0.210
MAX
A1
0.015
MIN
A2
0.130
±0.005
b
0.018
±0.002
b2
0.060
+0.010/-0.015
c
0.010
+0.004/-0.002
D
0.375
0.750
0.890
1.020
±0.010
1
E
0.310
+0.015/-0.010
E1
0.250
±0.005
2
e
0.100
Basic
eA
0.300
Basic
eB
0.345
±0.025
L
0.125
±0.010
N
8
14
16
18
20
Reference
Rev. C 2/07
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
D
L
A
e
b
A1
NOTE 5
A2
SEATING
PLANE
L
N
PIN #1
INDEX
E1
12
N/2
b2
E
eB
eA
c
相关PDF资料 |
PDF描述 |
|---|---|
| DS1013-40+ | IC DELAY LINE 40NS 14-DIP |
| DS1013-75+ | IC DELAY LINE 75NS 14-DIP |
| VI-B43-MV | CONVERTER MOD DC/DC 24V 150W |
| DS1013-30+ | IC DELAY LINE 30NS 14-DIP |
| X9313USZ-3 | IC XDCP 32-TAP 50K 3-WIRE 8-SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X9313WSZ-3T1 | 功能描述:IC XDCP 32-TAP 10K 3-WIRE 8-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻（欧姆）:100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行（芯片选择，递增，增/减） 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
| X9313WSZT1 | 功能描述:IC POT DGTL 10K OHM 8-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 35 ppm/°C 存储器类型:非易失 接口:3 线串口 电源电压:2.7 V ~ 5.25 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN-EP（3x3） 包装:剪切带 (CT) 产品目录页面:1399 (CN2011-ZH PDF) 其它名称:MAX5423ETA+TCT |
| X9313WV | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Interface IC |
| X9313WVI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Interface IC |
| X9313WVM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Interface IC |
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