参数资料
| 型号： | X9319US8IT1 |
| 厂商： | Intersil |
| 文件页数： | 2/10页 |
| 文件大小： | 0K |
| 描述： | IC DIGITAL POT 50K 100TAP 8-SOIC |
| 标准包装： | 2,500 |
| 系列： | XDCP™ |
| 接片： | 100 |
| 电阻（欧姆）： | 50k |
| 电路数： | 1 |
| 温度系数： | 标准值 ±300 ppm/°C |
| 存储器类型： | 非易失 |
| 接口： | 3 线串行（芯片选择，递增，增/减） |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8185.2
September 26, 2006
X9319
Plastic Dual-In-Line Packages (PDIP)
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
SYMBOL
PDIP8
PDIP14
PDIP16
PDIP18
PDIP20
TOLERANCE
NOTES
A
0.210
MAX
A1
0.015
MIN
A2
0.130
±0.005
b
0.018
±0.002
b2
0.060
+0.010/-0.015
c
0.010
+0.004/-0.002
D
0.375
0.750
0.890
1.020
±0.010
1
E
0.310
+0.015/-0.010
E1
0.250
±0.005
2
e
0.100
Basic
eA
0.300
Basic
eB
0.345
±0.025
L
0.125
±0.010
N
8
14
16
18
20
Reference
Rev. B 2/99
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
D
L
A
e
b
A1
NOTE 5
A2
SEATING
PLANE
L
N
PIN #1
INDEX
E1
12
N/2
b2
E
eB
eA
c
相关PDF资料 |
PDF描述 |
|---|---|
| VE-B3J-MV-S | CONVERTER MOD DC/DC 36V 150W |
| DS1099U-FF+ | IC ECONOSCILLATOR DUAL 8USOP |
| VE-B3H-MV-S | CONVERTER MOD DC/DC 52V 150W |
| V375B12H300BG | CONVERTER MOD DC/DC 12V 300W |
| MS3452L32-17PX | CONN RCPT 4POS BOX MNT W/PINS |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X9319US8IZ | 功能描述:IC POT DGTL 50K OHM 8-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 35 ppm/°C 存储器类型:非易失 接口:3 线串口 电源电压:2.7 V ~ 5.25 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN-EP（3x3） 包装:剪切带 (CT) 产品目录页面:1399 (CN2011-ZH PDF) 其它名称:MAX5423ETA+TCT |
| X9319US8Z | 功能描述:IC XDCP 100-TAP 50K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:256 电阻（欧姆）:100k 电路数:2 温度系数:标准值 35 ppm/°C 存储器类型:易失 接口:6 线串行（芯片选择，递增，增/减） 电源电压:2.6 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
| X9319WP8 | 功能描述:IC DIGITAL POT 10K 100TAP 8-DIP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:2,500 系列:XDCP™ 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 ±300 ppm/°C 存储器类型:非易失 接口:I²C（设备位址） 电源电压:2.7 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
| X9319WP8I | 功能描述:IC DIGITAL POT 10K 100TAP 8-DIP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:2,500 系列:XDCP™ 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 ±300 ppm/°C 存储器类型:非易失 接口:I²C（设备位址） 电源电压:2.7 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
| X9319WS8 | 功能描述:IC DIGITAL POT 10K 100TAP 8-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:2,500 系列:XDCP™ 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 ±300 ppm/°C 存储器类型:非易失 接口:I²C（设备位址） 电源电压:2.7 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
发布紧急采购，3分钟左右您将得到回复。