参数资料
型号: X9400WS24-2.7T1
厂商: Intersil
文件页数: 12/19页
文件大小: 0K
描述: IC XDCP QUAD 64-TAP 10K 24-SOIC
标准包装: 1,000
系列: XDCP™
接片: 64
电阻(欧姆): 10k
电路数: 4
温度系数: 标准值 ±300 ppm/°C
存储器类型: 非易失
接口: 6 线 SPI(芯片选择,设备位址)
电源电压: 2.7 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC
包装: 带卷 (TR)
2
FN8189.3
July 28, 2006
Ordering Information
PART NUMBER
PART
MARKING
VCC LIMITS
(V)
POTENTIOMETER
ORGANIZATION
(k
)
TEMPERATURE
RANGE
(°C)
PACKAGE
PKG. DWG. #
X9400WS24*
X9400WS
5 ±10%
10
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9400WS24ZT1
(Note)
X9400WS Z
0 to +70
24 Ld SOIC (300 mil) (Pb-free)
Tape and Reel
M24.3
X9400WS24I*
X9400WS I
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9400WS24IZ*
(Note)
X9400WS ZI
-40 to +85
24 Ld SOIC (300 mil) (Pb-free)
M24.3
X9400WV24*
X9400WV
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9400WV24I*
X9400WV I
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9400WV24IZ*
(Note)
X9400WV ZI
-40 to +85
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400WV24Z*
(Note)
X9400WV Z
0 to +70
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400YS24*
X9400YS
2.5
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9400YS24I*
X9400YS I
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9400YV24*
X9400YV
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9400YV24I*
X9400YV I
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9400YV24IZ*
(Note)
X9400YV ZI
-40 to +85
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400YV24Z*
(Note)
X9400YV Z
0 to +70
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400WS24-2.7*
X9400WS F
2.7 to 5.5
10
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9400WS24I-2.7*
X9400WS G
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9400WS24IZ-2.7*
(Note)
X9400WS ZG
-40 to +85
24 Ld SOIC (300 mil) (Pb-free)
M24.3
X9400WV24-2.7*
X9400WV F
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9400WV24I-2.7*
X9400WV G
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9400WV24IZ-2.7*
(Note)
X9400WV ZG
-40 to +85
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400WV24Z-2.7*
(Note)
X9400WV ZF
0 to +70
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400YS24-2.7*
X9400YS F
2.5
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9400YS24I-2.7*
X9400YS G
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9400YV24-2.7*
X9400YV F
0 to +70
24 Ld TSSOP (4.4mm)
MDP0044
X9400YV24I-2.7*
X9400YV G
-40 to +85
24 Ld TSSOP (4.4mm)
MDP0044
X9400YV24IZ-2.7*
(Note)
X9400YV ZG
-40 to +85
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
X9400YV24Z-2.7*
(Note)
X9400YV ZF
0 to +70
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9400
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X9400WS24I 功能描述:IC DCP QUAD 10K 64TP 24SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 标准包装:2,500 系列:XDCP™ 接片:256 电阻(欧姆):100k 电路数:1 温度系数:标准值 ±300 ppm/°C 存储器类型:非易失 接口:I²C(设备位址) 电源电压:2.7 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR)
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X9400WS24I-2.7T1 功能描述:IC XDCP QUAD 64-TAP 10K 24-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻(欧姆):50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型,TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR)
X9400WS24IT1 功能描述:IC XDCP QUAD 64-TAP 10K 24-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:XDCP™ 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 接片:32 电阻(欧姆):50k 电路数:1 温度系数:标准值 50 ppm/°C 存储器类型:易失 接口:3 线串行(芯片选择,递增,增/减) 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 细型,TSOT-23-6 供应商设备封装:TSOT-23-6 包装:带卷 (TR)
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