参数资料
型号: XA3S1600E-4FGG400I
厂商: Xilinx Inc
文件页数: 26/37页
文件大小: 0K
描述: IC FPGA SPARTAN-3E 1600K 400FBGA
标准包装: 60
系列: Spartan®-3E XA
LAB/CLB数: 3688
逻辑元件/单元数: 33192
RAM 位总计: 663552
输入/输出数: 304
门数: 1600000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 400-BGA
供应商设备封装: 400-FBGA(21x21)
DS635 (v2.0) September 9, 2009
Product Specification
32
R
Slave Parallel Mode Timing
Table 39: Timing for the Slave Parallel Configuration Mode
Symbol
Description
-4 Speed Grade
Units
Min
Max
Clock-to-Output Times
TSMCKBY
The time from the rising transition on the CCLK pin to a signal transition at the
BUSY pin
-12.0
ns
Setup Times
TSMDCC
The time from the setup of data at the D0-D7 pins to the active edge the CCLK
pin
11.0
-ns
TSMCSCC
Setup time on the CSI_B pin before the active edge of the CCLK pin
10.0
-ns
TSMCCW(2)
Setup time on the RDWR_B pin before active edge of the CCLK pin
23.0
-ns
Hold Times
TSMCCD
The time from the active edge of the CCLK pin to the point when data is last
held at the D0-D7 pins
1.0
-ns
TSMCCCS
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the CSO_B pin
0
-ns
TSMWCC
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the RDWR_B pin
0
-ns
Clock Timing
TCCH
The High pulse width at the CCLK input pin
5
-ns
TCCL
The Low pulse width at the CCLK input pin
5
-ns
FCCPAR
Frequency of the clock
signal at the CCLK input
pin
No bitstream
compression
Not using the BUSY pin(2)
050
MHz
Using the BUSY pin
0
66
MHz
With bitstream compression
0
20
MHz
Notes:
1.
The numbers in this table are based on the operating conditions set forth in Table 6.
2.
In the Slave Parallel mode, it is necessary to use the BUSY pin when the CCLK frequency exceeds this maximum specification.
3.
Some Xilinx documents refer to Parallel modes as “SelectMAP” modes.
相关PDF资料
PDF描述
ACB91DHRR-S621 CONN EDGECARD EXTEND 182POS .050
ABB91DHRR-S621 CONN EDGECARD EXTEND 182POS .050
ACB91DHRR-S578 CONN EDGECARD EXTEND 182POS .050
ABB91DHRR-S578 CONN EDGECARD EXTEND 182POS .050
XC3S2000-4FGG900I SPARTAN-3A FPGA 2M STD 900-FBGA
相关代理商/技术参数
参数描述
XA3S1600E-4FGG400Q 功能描述:IC FPGA SPARTAN-3E 1600K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S1600E-4FGG484I 功能描述:IC FPGA SPARTAN-3E 1600K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S1600E-4FGG484Q 功能描述:IC FPGA SPARTAN-3E 1600K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S200-4FTG256I 功能描述:IC FPGA SPARTAN-3 200K 256-FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S200-4FTG256Q 功能描述:IC FPGA SPARTAN-3 200K 256-FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)