参数资料
| 型号： | XA3S700A-4FGG400Q |
| 厂商： | Xilinx Inc |
| 文件页数： | 1/57页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3A 700K 400-FBGA |
| 产品培训模块： | Extended Spartan 3A FPGA Family |
| 标准包装： | 1 |
| 系列： | Spartan®-3A XA |
| LAB/CLB数： | 1472 |
| 逻辑元件/单元数： | 13248 |
| RAM 位总计： | 368640 |
| 输入/输出数： | 311 |
| 门数： | 700000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 400-BGA |
| 供应商设备封装： | 400-FBGA（21x21） |
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DS681 (v2.0) April 22, 2011
Product Specification
1
Copyright 2008–2011 Xilinx, Inc., Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the
United States and other countries. PCI, PCI Express, PCIe, and PCI-X are trademarks of PCI-SIG. All other trademarks are the property of their respective owners.
Summary
The Xilinx Automotive (XA) Spartan-3A family of FPGAs
solves the design challenges in most high-volume,
cost-sensitive, I/O-intensive automotive electronics
applications. The four-member family offers densities
ranging from 200,000 to 1.4 million system gates, as shown
in Table 1.
Introduction
XA devices are available in both extended-temperature
Q-Grade (–40°C to +125°C TJ) and I-Grade (–40°C to
+100°C TJ) and are qualified to the industry recognized
AEC-Q100 standard.
The XA Spartan-3A family builds on the success of the
earlier XA Spartan-3E and XA Spartan-3 FPGA families by
increasing the amount of I/O per logic, significantly reducing
the cost per I/O. New features improve system performance
and reduce the cost of configuration. These XA Spartan-3A
family enhancements, combined with proven 90 nm process
technology, deliver more functionality and bandwidth per
dollar than ever before, setting the new standard in the
programmable logic industry.
Because of their exceptionally low cost, XA Spartan-3A
FPGAs are ideally suited to a wide range of automotive
electronics applications, including infotainment, driver
information, and driver assistance modules.
The XA Spartan-3A family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial mask set
costs and lengthy development cycles, while also permitting
design upgrades in the field with no hardware replacement
necessary because of its inherent programmability, an
impossibility with conventional ASICs and ASSPs with their
inflexible architecture.
Features
Very low cost, high-performance logic solution for
high-volume, cost-conscious applications
Dual-range VCCAUX supply simplifies 3.3V-only design
Suspend, Hibernate modes reduce system power
Multi-voltage, multi-standard SelectIO interface pins
Up to 375 I/O pins or 165 differential signal pairs
LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
Selectable output drive, up to 24 mA per pin
QUIETIO standard reduces I/O switching noise
Full 3.3V
10% compatibility and hot swap compliance
640+ Mb/s data transfer rate per differential I/O
LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O
with integrated differential termination resistors
Enhanced Double Data Rate (DDR) support
DDR/DDR2 SDRAM support up to 266 Mb/s
Fully compliant 32-/64-bit, 33 MHz PCI technology
support
Abundant, flexible logic resources
Densities up to 25,344 logic cells, including optional shift
register or distributed RAM support
Efficient wide multiplexers, wide logic
Fast look-ahead carry logic
Enhanced 18 x 18 multipliers with optional pipeline
IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM memory architecture
Up to 576 Kbits of fast block RAM with byte write enables
for processor applications
Up to 176 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
Clock skew elimination (delay locked loop)
Frequency synthesis, multiplication, division
High-resolution phase shifting
Wide frequency range (5 MHz to over 320 MHz)
Eight low-skew global clock networks, eight additional
clocks per half device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
Low-cost, space-saving SPI serial Flash PROM
x8 or x8/x16 parallel NOR Flash PROM
Unique Device DNA identifier for design authentication
support plus Spartan-3A Starter Kit
MicroBlaze and PicoBlaze
embedded processor
cores
BGA packaging, Pb-free ONLY
Common footprints support easy density migration
Refer to the Spartan-3A FPGA Family Data Sheet (DS529)
for a full product description, AC and DC specifications, and
package pinout descriptions. Any values shown specifically
in this XA Spartan-3A Automotive FPGA Family data sheet
override those shown in DS529.
For information regarding reliability qualification, refer to
RPT103 (Xilinx Spartan-3A Family Automotive Qualification
Report) and RPT070 (Spartan-3A Commercial Qualification
Report).
57
XA Spartan-3A Automotive
FPGA Family Data Sheet
DS681 (v2.0) April 22, 2011
Product Specification
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XA3S700A-4FGG484I | 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S700A-4FGG484Q | 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3SD1800A | 制造商:XILINX 制造商全称:XILINX 功能描述:XA Spartan-3A DSP Automotive FPGA Family Data Sheet |
| XA3SD1800A-4CSG484I | 功能描述:SPARTAN-3ADSP FPGA 1800K 484CSBG RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XA3SD1800A-4CSG484Q | 功能描述:SPARTAN-3ADSP FPGA 1800K 484CSBG RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
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