参数资料
| 型号： | XA6SLX16-2CSG225I |
| 厂商： | Xilinx Inc |
| 文件页数： | 10/10页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN 6 14K 225CSGBGA |
| 标准包装： | 1 |
| 系列： | Spartan®-6 LX XA |
| LAB/CLB数： | 1139 |
| 逻辑元件/单元数： | 14579 |
| RAM 位总计： | 589824 |
| 输入/输出数： | 160 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 225-LFBGA，CSPBGA |
| 供应商设备封装： | 225-CSPBGA（13x13） |
XA Spartan-6 Automotive FPGA Family Overview
DS170 (v1.3) December 13, 2012
Product Specification
9
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XA6SLX16-2CSG225Q | 功能描述:IC FPGA SPARTAN 6 225CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-6 LX XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA6SLX16-2CSG324I | 功能描述:IC FPGA SPARTAN 6 14K 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-6 LX XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA6SLX16-2CSG324Q | 功能描述:IC FPGA SPARTAN 6 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-6 LX XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA6SLX16-2FTG256I | 功能描述:IC FPGA SPARTAN 6 14K 256FTGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-6 LX XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA6SLX16-2FTG256Q | 功能描述:IC FPGA SPARTAN 6 256FTGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-6 LX XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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