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参数资料
| 型号： | XC17S100APD8C |
| 厂商： | Xilinx Inc |
| 文件页数： | 8/8页 |
| 文件大小： | 0K |
| 描述： | IC PROM SER 100000 C-TEMP 8-DIP |
| 标准包装： | 50 |
| 可编程类型： | OTP |
| 存储容量： | 1Mb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
Spartan-II/Spartan-IIE Family OTP Configuration PROMs (XC17S00A)
DS078 (v1.10) June 25, 2007
Product Specification
8
R
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
Revision History
The following table shows the revision history for this document.
Date
Revision
09/14/00
1.0
Initial Xilinx release.
11/13/00
1.1
Updated configuration bits.
04/07/01
1.2
Added to features: “Guaranteed 20 year life data retention”, removed “Programming the FPGA with counters”
and related text.
06/20/01
1.3
Revised Figure 1 resistor values to match Spartan-II data sheet.
10/09/01
1.4
Added note for unlisted pins, changed ICCA and ICCS, and added power-on supply requirements and note
regarding power-on reset.
11/15/01
1.5
Updated for Spartan-IIE FPGA family.
06/25/02
1.6
Changed Table 1, page 4.
10/15/02
1.7
Changed Table 1, page 4. Added "Pinout Diagrams," page 2.
11/18/02
1.8
Added XC2S400E and XC2S600E to Compatible FPGAS table. Modified document title.
06/24/05
1.9
Combinations", and "Marking Information" figures. Removed TSOL from the "Absolute Maximum Ratings(1)"
table.
06/25/07
1.10
Updated format.
Added Pb-free (RoHS-compliant) packaging.
Timing diagram removed from Figure 1, page 3.
Part Numbers XC17S200APDG8I, and XC17S200AVOG8I added to "3.3V Valid Ordering Combinations,"
17S15A
V
C
Operating Range/Processing
C=Commercial (TA = 0
° C to +70° C)
I=Industrial (TA = –40
° C to +85° C)
Package Mark
P=8-pin Plastic DIP
V=8-pin Plastic Small-Outline Thin Package
S=20-pin Plastic Small-Outline Package
VQ=44-pin Plastic Quad Flat Package
G=8-pin Plastic Small-Outline Thin Package, Pb free (RoHS compliant)
H=8-pin Plastic DIP, Lead Free
Device Marking
17S15A
17S30A
17S50A
17S100A
17S150A
17S200A
17S300A
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相关代理商/技术参数 |
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|---|---|
| XC17S100APD8I | 功能描述:IC PROM SER 100000 I-TEMP 8-DIP RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S100ASO20C | 功能描述:IC PROM SER 100000 C-TEMP 20SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S100ASO20I | 功能描述:IC PROM SER 100000 I-TEMP 20SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S100AVO8C | 功能描述:IC PROM SER 10K 8-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S100AVO8I | 功能描述:IC PROM SER 10K 8-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
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