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参数资料
| 型号： | XC17S10XLVO8I |
| 厂商： | Xilinx Inc |
| 文件页数： | 2/11页 |
| 文件大小： | 0K |
| 描述： | IC 3V PROM SER 10K 8-SOIC |
| 产品变化通告： | Product Discontinuation 28/Jul/2010 |
| 标准包装： | 98 |
| 可编程类型： | OTP |
| 存储容量： | 100kb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-TSOP |
| 包装： | 管件 |
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
10
R
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
Note: When marking the device number on the XL parts, an L is used in place of an XL.
Revision History
The following table shows the revision history for this document.
Date
Revision
07/14/98
1.1
09/08/98
1.2
Clarified the SPARTAN FPGA and PROM interface by removing references to CEO pin. Removed the ESD
notation in Absolute Maximum table since it is now included in Xilinx’s Reliability Monitor Report.
01/20/00
1.3
Added additional Spartan-XL parts, changed SPROM to PROM.
02/18/00
1.4
Changed device ordering numbers, added 4.7K resistor to OE/RESET in Figure 1.
04/04/00
1.5
Added XC17S200XL PROM for Spartan XC2S200.
08/06/00
1.6
Updated format.
04/07/01
1.7
Added to features: “Guaranteed 20 year life data retention.”
10/10/01
1.8
11/04/02
1.9
Updated Table 1, page 2. Updated the template. Added "Pinout Diagrams," page 2.
11/18/02
1.10
Modified document title.
17S20L
V
C
Operating Range/Processing
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
Package Mark
O = 8-pin Plastic Small-Outline Package, Lead-Free
P = 8-pin Plastic DIP
H = 8-pin Plastic DIP, Lead-Free
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Lead-Free
S = 20-pin Plastic Small-Outline Package
Device Number
17S05
17S05L
17S10
17S10L
17S20
17S20L
17S30
17S30L
17S40
17S40L
17S50L
17S100L
17S150L
Product Obsolete or Under Obsolescence
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相关代理商/技术参数 |
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| XC17S10XLVOG8C | 功能描述:IC PROM SERIEAL 10K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S10XLVOG8I | 功能描述:IC PROM SERIEAL 10K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S150APD8C | 功能描述:IC PROM SER 150000 C-TEMP 8-DIP RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S150APD8C0280 | 制造商:Xilinx 功能描述: |
| XC17S150APD8I | 功能描述:IC PROM SER 150000 I-TEMP 8-DIP RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
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