参数资料
型号: XC17V02VQ44C
厂商: Xilinx Inc
文件页数: 1/15页
文件大小: 0K
描述: IC PROM SER 2MBIT 3.3V 44-VQFP
产品变化通告: Product Discontinuation Notice 14/May/2007
标准包装: 160
可编程类型: OTP
存储容量: 2Mb
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 44-TQFP
供应商设备封装: 44-VQFP(10x10)
包装: 托盘
DS073 (v2.0) April 7, 2014
Product Specification
1
Copyright 2000–2014 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners.
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Features
One-time programmable (OTP) read-only memory
designed to store configuration bitstreams of
Xilinx FPGA devices
Simple interface to the FPGA
Cascadable for storing longer or multiple bitstreams
Programmable reset polarity (active High or active
Low) for compatibility with different FPGA solutions
Low-power CMOS floating-gate process
3.3V supply voltage
Guaranteed 20 year life data retention
Available in compact plastic packages: VQ44, PC44,
PC20, VO8, and SO20(1)
Programming support by leading programmer
manufacturers
Design support using the ISE Foundation and
ISE WebPACK software
Dual configuration modes for the XC17V16 and
XC17V08(1) devices
Serial slow/fast configuration (up to 20 Mb/s)
Parallel (up to 160 Mb/s at 20 MHz)
Description
Xilinx introduces the high-density XC17V00 family of
configuration PROMs which provide an easy-to-use, cost-
effective method for storing large Xilinx FPGA configuration
bitstreams. Initial devices in the 3.3V family are available in
16 Mb, 8 Mb, 4 Mb, 2 Mb, and 1 Mb densities. See Figure 1
and Figure 2 for simplified block diagrams of the XC17V00
family.
The XC17V00 PROM can configure a Xilinx FPGA using
the FPGA serial configuration mode interface. When the
FPGA is in Master Serial mode, it generates a configuration
clock that drives the PROM. A short access time after the
rising clock edge, data appears on the PROM DATA output
pin that is connected to the FPGA DIN pin. The FPGA
generates the appropriate number of clock pulses to
complete the configuration. Once configured, it disables the
PROM. When the FPGA is in Slave Serial mode, the PROM
and the FPGA must both be clocked by an incoming signal.
The XC17V08(1) and XC17V16 PROM can optionally
configure a Xilinx FPGA using the FPGA Parallel
(SelectMAP) configuration mode interface. When the FPGA
is in Master SelectMAP mode, the FPGA generates the
configuration clock that drives the PROM.
When the FPGA is in Slave SelectMAP mode, an external,
free-running oscillator generates the configuration clock
that drives the PROM and the FPGA. After the rising
configuration clock (CCLK) edge, data is available on the
PROMs DATA (D0-D7) pins. The data is clocked into the
FPGA on the following rising edge of the CCLK (Figure 3).
Multiple PROMs can be concatenated by using the CEO
output to drive the CE input of the following device. The
clock inputs and the DATA outputs of all PROMs in this
chain are interconnected. All devices are compatible and
can be cascaded with other members of the family.
For device programming, either the Xilinx ISE Foundation or
ISE WebPACK software compiles the FPGA design file into
a standard Hex format, which is then transferred to most
commercial PROM programmers.
0
XC17V00 Series Configuration PROMs
DS073 (v2.0) April 7, 2014
08
Product Specification
R
1. Specific part number and package combinations have been discontinued. Refer to XCN07010. Discontinued part number and package combinations
remain in this data sheet for reference.
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XC17V04PC20I 功能描述:IC PROM SER 4MBIT 3.3V 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-TSOP 包装:管件
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XC17V04PC44I 功能描述:IC PROM SER 4MBIT 3.3V 44-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-TSOP 包装:管件