参数资料
| 型号： | XC2S50E-6FTG256C |
| 厂商： | Xilinx Inc |
| 文件页数： | 17/108页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-IIE FPGA 50K 256FTBGA |
| 产品变化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 标准包装： | 90 |
| 系列： | Spartan®-IIE |
| LAB/CLB数： | 384 |
| 逻辑元件/单元数： | 1728 |
| RAM 位总计： | 32768 |
| 输入/输出数： | 182 |
| 门数： | 50000 |
| 电源电压： | 1.71 V ~ 1.89 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FTBGA |
| 其它名称： | 122-1328 |
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16
DS077-2 (v3.0) August 9, 2013
Product Specification
Spartan-IIE FPGA Family: Functional Description
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Table 7 shows the depth and width aspect ratios for the
block RAM.
The Spartan-IIE FPGA block RAM also includes dedicated
routing to provide an efficient interface with both CLBs and
other block RAMs. See Xilinx Application Note XAPP173 for
more information on block RAM.
Programmable Routing
It is the longest delay path that limits the speed of any
design. Consequently, the Spartan-IIE FPGA routing archi-
tecture and its place-and-route software were defined jointly
to minimize long-path delays and yield the best system per-
formance.
The joint optimization also reduces design compilation
times because the architecture is software-friendly. Design
cycles are correspondingly reduced due to shorter design
iteration times.
The software automatically uses the best available routing
based on user timing requirements. The details are pro-
vided here for reference.
Local Routing
The local routing resources, as shown in Figure 9, provide
the following three types of connections:
Interconnections among the LUTs, flip-flops, and
General Routing Matrix (GRM), described below.
Internal CLB feedback paths that provide high-speed
connections to LUTs within the same CLB, chaining
them together with minimal routing delay
Direct paths that provide high-speed connections
between horizontally adjacent CLBs, eliminating the
delay of the GRM
General Purpose Routing
Most Spartan-IIE FPGA signals are routed on the general
purpose routing, and consequently, the majority of intercon-
nect resources are associated with this level of the routing
hierarchy. The general routing resources are located in hor-
izontal and vertical routing channels associated with the
rows and columns of CLBs. The general-purpose routing
resources are listed below.
Adjacent to each CLB is a General Routing Matrix
(GRM). The GRM is the switch matrix through which
horizontal and vertical routing resources connect, and
is also the means by which the CLB gains access to
the general purpose routing.
24 single-length lines route GRM signals to adjacent
GRMs in each of the four directions.
96 buffered Hex lines route GRM signals to other
GRMs six blocks away in each one of the four
directions. Organized in a staggered pattern, Hex lines
may be driven only at their endpoints. Hex-line signals
can be accessed either at the endpoints or at the
midpoint (three blocks from the source). One third of
the Hex lines are bidirectional, while the remaining
ones are unidirectional.
12 Longlines are buffered, bidirectional wires that
distribute signals across the device quickly and
efficiently. Vertical Longlines span the full height of the
device, and horizontal ones span the full width of the
device.
I/O Routing
Spartan-IIE devices have additional routing resources
around their periphery that form an interface between the
CLB array and the IOBs. This additional routing, called the
VersaRing routing, facilitates pin-swapping and pin-lock-
ing, such that logic redesigns can adapt to existing PCB lay-
outs. Time-to-market is reduced, since PCBs and other
system components can be manufactured while the logic
design is still in progress.
Table 7: Block RAM Port Aspect Ratios
Width
Depth
ADDR Bus
Data Bus
1
4096
ADDR<11:0>
DATA<0>
2
2048
ADDR<10:0>
DATA<1:0>
4
1024
ADDR<9:0>
DATA<3:0>
8
512
ADDR<8:0>
DATA<7:0>
16
256
ADDR<7:0>
DATA<15:0>
Figure 9: Spartan-IIE Local Routing
DS001_06_032300
CLB
GRM
To
Adjacent
GRM
To Adjacent
GRM
Direct
Connection
To Adjacent
CLB
To Adjacent
GRM
To Adjacent
GRM
Direct Connection
To Adjacent
CLB
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| XC2S50E-6FTG256I | 功能描述:IC SPARTAN-IIE FPGA 50K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S50E-6PQ208C | 功能描述:IC FPGA 1.8V 384 CLB'S 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S50E-6PQ208I | 制造商:Xilinx 功能描述:IC SPARTAN-IIE FPGA 50K 208-PQFP 制造商:Xilinx 功能描述:IC FPGA 146 I/O 208PQFP |
| XC2S50E-6PQG208C | 功能描述:IC SPARTAN-IIE FPGA 50K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28） |
| XC2S50E-6PQG208I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
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