参数资料
型号: XC3S200A-4VQG100I
厂商: Xilinx Inc
文件页数: 1/2页
文件大小: 0K
描述: IC FPGA SPARTAN-3A 200K 100-VQFP
产品培训模块: Extended Spartan 3A FPGA Family
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 448
逻辑元件/单元数: 4032
RAM 位总计: 294912
输入/输出数: 68
门数: 200000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 100-TQFP
供应商设备封装: 100-VQFP(14x14)
产品目录页面: 599 (CN2011-ZH PDF)
其它名称: 122-1595
XC3S200A-4VQG100I-ND
The Programmable Logic
Challenge of I/O Intensive
Designs
Traditional FPGAs are proportionate
between logic and I/O not being cost-
effective for I/O intensive designs
System designers need to quickly adapt
to fast-evolving I/O standards
High volume consumer applications
require low-cost and robust security
solutions
The Xilinx FPGA Solution
The Spartan-3A FPGAs were designed
for applications where I/O count and
capabilities matter more than logic density
The Spartan-3A platform delivers up to
502 I/Os with support for industry-leading
26 popular and emerging I/O standards
The industry’s first 90nm FPGA electronic
ID - Device DNA serial number provides
a cost-effective, robust mechanism to help
protect against reverse-engineering,
cloning and overbuilding
Xilinx is driving the multiple domain-optimized platforms for highly efficient and
optimal design solutions, instead of forcing inefficient, one-size-fits-all solutions on
significantly varying application requirements.
Spartan-3A Platform Key Features
Standard Low-Cost Features
The Spartan-3A FPGA platform is a full feature platform of five devices with
system gates ranging from 50K to 1.4M gates, and I/Os ranging from 108 to 502
I/Os, with density migration. The Spartan-3A FPGAs also support up to 576 Kbits of
fast-block RAM with byte-write enable, and up to 176 Kbits of distributed RAM.
Additionally, there are built-in multipliers for efficient DSP implementation and
Digital Clock Managers (DCMs) for system level clock management functions.
Advance Features
The advance features in the Spartan-3A platform include unique Device DNA
serial number, support for 26 I/O standards, enhanced Multi-Boot capability
with watchdog timer, dual power management modes, and Dynamic Input
Delay for precise data-to-clock centering. These advance features significantly
help shorten design cycles and lower system cost.
SPARTAN-3 GENERATION FPGAs
Xilinx Spartan
-3A FPGA Platform
The World’s Lowest-Cost I/O Optimized FPGAs
相关PDF资料
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GBM10DCSN CONN EDGECARD 20POS DIP .156 SLD
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GBM10DCSD CONN EDGECARD 20POS DIP .156 SLD
VI-21L-EU CONVERTER MOD DC/DC 28V 200W
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XC3S200A-5FG320C 功能描述:IC SPARTAN-3A FPGA 200K 320FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S200A-5FGG320C 功能描述:IC SPARTAN-3A FPGA 200K 320-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S200A-5FT256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S200A-5FTG256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
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