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| 型号： | XC3S700A-4FTG256I |
| 厂商： | Xilinx Inc |
| 文件页数： | 2/2页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3A 256K 256FTBGA |
| 产品培训模块： | Extended Spartan 3A FPGA Family |
| 标准包装： | 90 |
| 系列： | Spartan®-3A |
| LAB/CLB数： | 1472 |
| 逻辑元件/单元数： | 13248 |
| RAM 位总计： | 368640 |
| 输入/输出数： | 161 |
| 门数： | 700000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FTBGA |
| 配用： | 122-1514-ND - KIT STARTER W/SPARTAN-3A |
| 其它名称： | 122-1722 XC3S700A-4FTG256I-ND |
Corporate Headquarters
Xilinx, Inc.
2100 Logic Drive
San Jose, CA 95124
Tel: 408-559-7778
Fax: 408-559-7114
Web: www.xilinx.com
Europe Headquarters
Xilinx Ireland
One Logic Drive
Citywest Business Campus
Saggart, County Dublin
Ireland
Tel: +353-1-464-0311
Fax: +353-1-464-0324
Web: www.xilinx.com
Japan
Art Village Osaki Central Tower 4F
1-2-2 Osaki, Shinagawa-ku
Tokyo Japan
Zip: 141-0032
Phone +81-36744-7777
Web: japan.xilinx.com
Asia Pacific Pte. Ltd.
Xilinx, Asia Pacific
No. 3 Changi Business Park Vista, #04-01
Singapore 486051
Tel: (65) 6544-8999
Fax: (65) 6789-8886
Web: www.xilinx.com
www.xilinx.com
Copyright 2OO7 Xilinx, Inc. All rights reserved. XILINX, the Xilinx Logo, and other designated
brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of
their respective owners
Printed in U.S.A. PN 2010
Industry’s first 90nm FPGA Electronic Serial Numbering
Each FPGA includes a permanent unique Device DNA serial number that can be used to
safeguard both hardware and software IP. It is ideal for tracking production serial numbers,
product registrations and system ID. Customers have complete flexibility in implementing
custom algorithms for the security solutions that can significantly deter reverse-engineering,
cloning and overbuilding.
Widest Support for I/O Standards
The Spartan-3A FPGA is especially suitable for display devices supporting both TMDS and
PPDS standards. With support for 26 popular single-ended and differential signaling stan-
dards including TMDS, PPDS, SSTL3 Class I & II, full hot-swap compliance, and pre-engi-
neered interface IP solutions such as PCI, PCI Express, USB, Firewire, CAN, SPI, I2C, etc, the
Spartan-3A platform provides an industry-leading connectivity solution.
Comprehensive Configuration Capabilities
The Spartan-3A platform features enhanced Multi-Boot capability with watchdog timer for
guaranteed “golden” configuration. This enables intelligent recovery from configuration
errors and improves field upgradeability.
Flexible Power-Management Modes
A new Suspend mode provides a very flexible and effective way to preserve power. In this
mode, the power is comparable to quiescent current, and the configuration data as well as
flip-flop and RAM values are maintained. It also includes a fast wake-up mechanism and sys-
tem level synchronization across time domains.
Dynamic Input Delay
Selecting delay-length for both registered and combinatorial inputs allows for precise timing
relationship adjustment between clock and data. Combinatorial input delay can now also be
dynamically changed through the interconnect. Source synchronous designs will significantly
benefit from this feature.
Take the Next Step
Visit our website www.xilinx.com/spartan3a or call your local sale office or distributor for
more information about Spartan-3A FPGAs. To start your design immediately, download
your free ISE WebPACKTM design tools at www.xilinx.com/ise. To begin evaluating Spartan-3A
FPGAs, order your hardware development board at www.xilinx.com/s3astarter
Spartan-3A FPGA Platform
Device
XC3S50A
XC3S200A
XC3S400A
XC3S700A
XC3S1400A
System Gates
50K
200K
400K
700K
1400K
Logic Cells
1,584
4,032
8,064
13,248
25,344
Dedicated Multipliers
3
16
20
32
Block RAM Blocks
3
16
20
32
Block RAM Bits
54K
288K
360K
576K
Distributed RAM Bits
11K
28K
56K
92K
176K
DCMs
2
4
8
I/O Standards
26
Max Differential I/O
64
112
142
165
227
Max Single Ended I/O
144
248
311
372
502
Package and I/O Offerings
Device
XC3S50A
XC3S200A
XC3S400A
XC3S700A
XC3S1400A
TQ144 20 x 20 mm
108
FT256 17 x 17 mm
144
195
FG320 19 x 19 mm
248
251
FG400 21 x 21 mm
311
FG484 23 x 23 mm
372
375
FG676 27 x 27 mm
502
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相关代理商/技术参数 |
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| XC3S700A-5FG400C | 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC3S700A-5FG484C | 功能描述:IC SPARTAN-3A FPGA 700K 484FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC3S700A-5FGG400C | 功能描述:IC SPARTAN-3A FPGA 700K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC3S700A-5FGG484C | 功能描述:IC SPARTAN-3A FPGA 700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC3S700A-5FT256C | 制造商:Xilinx 功能描述:FPGA SPARTAN?-3A FAMILY 700K GATES 13248 CELLS 770MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA SPARTAN-3A 256K 256FTBGA |
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