参数资料
| 型号： | XC4062XL-1HQ240I |
| 厂商： | Xilinx Inc |
| 文件页数： | 21/68页 |
| 文件大小： | 0K |
| 描述： | IC FPGA I-TEMP 3.3V 1SPD 240HQFP |
| 产品变化通告： | Product Discontinuation 19/Feb/2007 |
| 标准包装： | 1 |
| 系列： | XC4000E/X |
| LAB/CLB数： | 2304 |
| 逻辑元件/单元数： | 5472 |
| RAM 位总计： | 73728 |
| 输入/输出数： | 193 |
| 门数： | 62000 |
| 电源电压： | 3 V ~ 3.6 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 240-BFQFP 裸露焊盘 |
| 供应商设备封装： | 240-PQFP（32x32） |
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R
XC4000E and XC4000X Series Field Programmable Gate Arrays
6-32
May 14, 1999 (Version 1.6)
circuit prevents undened oating levels. However, it is
overridden by any driver, even a pull-up resistor.
Each XC4000E longline has a programmable splitter switch
at its center, as does each XC4000X longline driven by
TBUFs. This switch can separate the line into two indepen-
dent routing channels, each running half the width or height
of the array.
Each XC4000X longline not driven by TBUFs has a buff-
ered programmable splitter switch at the 1/4, 1/2, and 3/4
points of the array. Due to the buffering, XC4000X longline
performance does not deteriorate with the larger array
sizes. If the longline is split, the resulting partial longlines
are independent.
Routing connectivity of the longlines is shown in Figure 27
Direct Interconnect (XC4000X only)
The XC4000X offers two direct, efcient and fast connec-
tions between adjacent CLBs. These nets facilitate a data
ow from the left to the right side of the device, or from the
top to the bottom, as shown in Figure 30. Signals routed on
the direct interconnect exhibit minimum interconnect prop-
agation delay and use no general routing resources.
The direct interconnect is also present between CLBs and
adjacent IOBs. Each IOB on the left and top device edges
has a direct path to the nearest CLB. Each CLB on the right
and bottom edges of the array has a direct path to the near-
est two IOBs, since there are two IOBs for each row or col-
umn of CLBs.
The place and route software uses direct interconnect
whenever possible, to maximize routing resources and min-
imize interconnect delays.
I/O Routing
XC4000 Series devices have additional routing around the
IOB ring. This routing is called a VersaRing. The VersaRing
facilitates pin-swapping and redesign without affecting
board layout. Included are eight double-length lines span-
ning two CLBs (four IOBs), and four longlines. Global lines
and Wide Edge Decoder lines are provided. XC4000X
devices also include eight octal lines.
A high-level diagram of the VersaRing is shown in
Figure 31. The shaded arrows represent routing present
only in XC4000X devices.
Figure 33 on page 34 is a detailed diagram of the XC4000E
and XC4000X VersaRing. The area shown includes two
IOBs. There are two IOBs per CLB row or column, there-
fore this diagram corresponds to the CLB routing diagram
shown in Figure 27 on page 30. The shaded areas repre-
sent routing and routing connections present only in
XC4000X devices.
Octal I/O Routing (XC4000X only)
Between the XC4000X CLB array and the pad ring, eight
interconnect tracks provide for versatility in pin assignment
and xed pinout exibility. (See Figure 32 on page 33.)
These routing tracks are called octals, because they can be
broken every eight CLBs (sixteen IOBs) by a programma-
ble buffer that also functions as a splitter switch. The buffers
are staggered, so each line goes through a buffer at every
eighth CLB location around the device edge.
The octal lines bend around the corners of the device. The
lines cross at the corners in such a way that the segment
most recently buffered before the turn has the farthest dis-
tance to travel before the next buffer, as shown in
CLB
IOB
X6603
IOB
CLB
~~
~ ~
Figure 30: XC4000X Direct Interconnect
Product Obsolete or Under Obsolescence
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| XC4062XL-1HQ304C | 功能描述:IC FPGA C-TEMP 3.3V 1SPD 304HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XC4062XL-1HQ304I | 功能描述:IC FPGA I-TEMP 3.3V 1SPD 304HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XC4062XL-2BG432C | 功能描述:IC FPGA C-TEMP 3.3V 2SPD 432MBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XC4062XL-2BG432I | 功能描述:IC FPGA I-TEMP 3.3V 2SPD 432MBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XC4062XL-2BG560C | 功能描述:IC FPGA C-TEMP 3.3V 2SPD 560MBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
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