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| 型号： | XC4VFX100-10FFG1152I |
| 厂商： | XILINX INC |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 10544 CLBS, 1028 MHz, PBGA1152 |
| 封装： | LEAD FREE, FBGA-1152 |
| 文件页数： | 12/58页 |
| 文件大小： | 1863K |
| 代理商： | XC4VFX100-10FFG1152I |
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Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
DS302 (v3.7) September 9, 2009
Product Specification
2
VTS
Voltage applied to 3-state 3.3V output
(all user and dedicated I/Os)
–0.75 to 4.05
V
Voltage applied to 3-state 3.3V output
(restricted to maximum of 100 user I/Os)(3,4)
–0.95 to 4.4
(Commercial Temperature)
–0.85 to 4.3
(Industrial Temperature)
V
2.5V or below I/O input voltage relative to GND
(user and dedicated I/Os)
–0.75 to VCCO +0.5
V
AVCCAUXRX
Receive auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 1.32
V
AVCCAUXTX
Transmit auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 1.32
V
AVCCAUXMGT
Management auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 3.0
V
VTRX
Terminal receive supply voltage relative to GND
–0.5 to 3.0
V
VTTX
Terminal transmit supply voltage relative to GND
–0.5 to 1.65
V
TSTG
Storage temperature (ambient)
–65 to 150
° C
TSOL
Maximum soldering temperature(2)
+220
° C
TJ
Maximum junction temperature(2)
+125
° C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2.
For soldering guidelines and thermal considerations, see the Virtex-4 Packaging and Pinout Specification on the Xilinx website.
3.
When using more than 100 3.3V I/Os, refer to the Virtex-4 FPGA User Guide, Chapter 6, “3.3V I/O Design Guidelines.”
4.
For more flexibility in specific designs, a maximum of 100 user I/Os can be stressed beyond the normal spec for no more than 20% of a data period.
There are no bank restrictions.
Table 2: Recommended Operating Conditions
Symbol
Description
Min
Max
Units
VCCINT
Internal supply voltage relative to GND, TJ =0° C to +85° C
Commercial
1.14
1.26
V
Internal supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.14
1.26
V
VCCAUX
Auxiliary supply voltage relative to GND, TJ =0° C to +85° C
Commercial
2.375
2.625
V
Auxiliary supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
2.375
2.625
V
VCCO(1,3,4,5)
Supply voltage relative to GND, TJ =0° C to +85° C
Commercial
1.14
3.45
V
Supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.14
3.45
V
VIN
3.3V supply voltage relative to GND, TJ =0° C to +85° C
Commercial
GND – 0.20
3.45
V
3.3V supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
GND – 0.20
3.45
V
2.5V and below supply voltage relative to GND,
TJ =0° C to +85° C
Commercial
GND – 0.20
VCCO +0.2
V
2.5V and below supply voltage relative to GND,
TJ =–40° C to +100° C
Industrial
GND – 0.20
VCCO +0.2
V
IIN
Maximum current through any pin in a powered or unpowered
bank when forward biasing the clamp diode.
Commercial
10
mA
Industrial
10
mA
VBATT(2)
Battery voltage relative to GND, TJ =0° C to +85° CCommercial
1.0
3.6
V
Battery voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.0
3.6
V
Table 1: Absolute Maximum Ratings (Continued)
Symbol
Description
Units
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