参数资料
| 型号： | XC4VLX25-10SFG363C |
| 厂商： | Xilinx Inc |
| 文件页数： | 12/58页 |
| 文件大小： | 0K |
| 描述： | IC FPGA VIRTEX-4 24K 363-FCBGA |
| 标准包装： | 90 |
| 系列： | Virtex®-4 LX |
| LAB/CLB数： | 2688 |
| 逻辑元件/单元数： | 24192 |
| RAM 位总计： | 1327104 |
| 输入/输出数： | 240 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 363-FBGA，FCBGA |
| 供应商设备封装： | 363-FCBGA（17x17） |
| 配用： | 807-1004-ND - DAUGHTER CARD WITH VIRTEX-4 122-1523-ND - EVALUATION PLATFORM VIRTEX-4 |
| 其它名称： | 122-1489 |
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Virtex-4 FPGA Data Sheet: DC and Switching Characteristics
DS302 (v3.7) September 9, 2009
Product Specification
2
VTS
Voltage applied to 3-state 3.3V output
(all user and dedicated I/Os)
–0.75 to 4.05
V
Voltage applied to 3-state 3.3V output
(restricted to maximum of 100 user I/Os)(3,4)
–0.95 to 4.4
(Commercial Temperature)
–0.85 to 4.3
(Industrial Temperature)
V
2.5V or below I/O input voltage relative to GND
(user and dedicated I/Os)
–0.75 to VCCO +0.5
V
AVCCAUXRX
Receive auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 1.32
V
AVCCAUXTX
Transmit auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 1.32
V
AVCCAUXMGT
Management auxiliary supply voltage relative to analog ground, GNDA
(RocketIO pins)
–0.5 to 3.0
V
VTRX
Terminal receive supply voltage relative to GND
–0.5 to 3.0
V
VTTX
Terminal transmit supply voltage relative to GND
–0.5 to 1.65
V
TSTG
Storage temperature (ambient)
–65 to 150
° C
TSOL
Maximum soldering temperature(2)
+220
° C
TJ
Maximum junction temperature(2)
+125
° C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2.
For soldering guidelines and thermal considerations, see the Virtex-4 Packaging and Pinout Specification on the Xilinx website.
3.
When using more than 100 3.3V I/Os, refer to the Virtex-4 FPGA User Guide, Chapter 6, “3.3V I/O Design Guidelines.”
4.
For more flexibility in specific designs, a maximum of 100 user I/Os can be stressed beyond the normal spec for no more than 20% of a data period.
There are no bank restrictions.
Table 2: Recommended Operating Conditions
Symbol
Description
Min
Max
Units
VCCINT
Internal supply voltage relative to GND, TJ =0° C to +85° C
Commercial
1.14
1.26
V
Internal supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.14
1.26
V
VCCAUX
Auxiliary supply voltage relative to GND, TJ =0° C to +85° C
Commercial
2.375
2.625
V
Auxiliary supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
2.375
2.625
V
VCCO(1,3,4,5)
Supply voltage relative to GND, TJ =0° C to +85° C
Commercial
1.14
3.45
V
Supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.14
3.45
V
VIN
3.3V supply voltage relative to GND, TJ =0° C to +85° C
Commercial
GND – 0.20
3.45
V
3.3V supply voltage relative to GND, TJ = –40° C to +100° C
Industrial
GND – 0.20
3.45
V
2.5V and below supply voltage relative to GND,
TJ =0° C to +85° C
Commercial
GND – 0.20
VCCO +0.2
V
2.5V and below supply voltage relative to GND,
TJ =–40° C to +100° C
Industrial
GND – 0.20
VCCO +0.2
V
IIN
Maximum current through any pin in a powered or unpowered
bank when forward biasing the clamp diode.
Commercial
10
mA
Industrial
10
mA
VBATT(2)
Battery voltage relative to GND, TJ =0° C to +85° CCommercial
1.0
3.6
V
Battery voltage relative to GND, TJ = –40° C to +100° C
Industrial
1.0
3.6
V
Table 1: Absolute Maximum Ratings (Continued)
Symbol
Description
Units
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC4VLX25-10SFG363I | 功能描述:IC FPGA VIRTEX-4 LX 25K 363FCBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-4 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC4VLX25-11FF668C | 功能描述:IC FPGA VIRTEX-4 24K 668-FCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-4 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC4VLX25-11FF668CES | 制造商:Xilinx 功能描述: |
| XC4VLX25-11FF668I | 功能描述:IC FPGA VIRTEX-4LX 668FFBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-4 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC4VLX25-11FFG668C | 功能描述:IC FPGA VIRTEX-4 24K 668-FCBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-4 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
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