参数资料
型号: XC5VLX110-1FF1760C
厂商: Xilinx Inc
文件页数: 47/91页
文件大小: 0K
描述: IC FPGA VIRTEX-5 110K 1760FBGA
标准包装: 1
系列: Virtex®-5 LX
LAB/CLB数: 8640
逻辑元件/单元数: 110592
RAM 位总计: 4718592
输入/输出数: 800
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 1760-BBGA,FCBGA
供应商设备封装: 1760-FCBGA
配用: 568-5088-ND - BOARD DEMO DAC1408D750
HW-V5-ML523-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-AFX-FF1760-500-G-ND - BOARD DEV VIRTEX 5 FF1760
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
Product Specification
51
Configuration Switching Characteristics
Table 70: Configuration Switching Characteristics
Symbol
Description
Speed Grade
Units
-3
-2
-1
Power-up Timing Characteristics
TPL
Program Latency
3
ms, Max
TPOR
Power-on-Reset
10
50
10
50
10
50
ms, Min/Max
TICCK
CCLK (output) delay
400
ns, Min
TPROGRAM
Program Pulse Width
250
ns, Min
Master/Slave Serial Mode Programming Switching(1)
TDCCK/TCCKD
DIN Setup/Hold, slave mode
4.0
0.0
4.0
0.0
4.0
0.0
ns, Min
TDSCCK/TSCCKD
DIN Setup/Hold, master mode
4.0
0.0
4.0
0.0
4.0
0.0
ns, Min
TCCO
DOUT
7.5
ns, Max
FMCCK
Maximum Frequency, master mode with
respect to nominal CCLK.
100
MHz,
Max
FMCCKTOL
Frequency Tolerance, master mode with
respect to nominal CCLK.
±50
%
FMSCCK
Slave mode external CCLK
100
MHz
SelectMAP Mode Programming Switching(1)
TSMDCCK/TSMCCKD
SelectMAP Data Setup/Hold
3.0
0.5
3.0
0.5
3.0
0.5
ns, Min
TSMCSCCK/TSMCCKCS
CS_B Setup/Hold
3.0
0.5
3.0
0.5
3.0
0.5
ns, Min
TSMCCKW/TSMWCCK
RDWR_B Setup/Hold
8.0
0.5
8.0
0.5
8.0
0.5
ns, Min
TSMCKCSO
CSO_B clock to out
(330
Ω pull-up resistor required)
10
ns, Min
TSMCO
CCLK to DATA out in readback
9.0
ns, Max
TSMCKBY
CCLK to BUSY out in readback
7.5
ns, Max
FSMCCK
Maximum Frequency with respect to nominal
CCLK.
100
MHz, Max
FRBCCK
Maximum Readback Frequency with respect
to nominal CCLK
60
MHz, Max
FMCCKTOL
Frequency Tolerance with respect to nominal
CCLK.
±50
%
Boundary-Scan Port Timing Specifications
TTAPTCK
TMS and TDI Setup time before TCK
1.0
ns, Min
TTCKTAP
TMS and TDI Hold time after TCK
2.0
ns, Min
TTCKTDO
TCK falling edge to TDO output valid
6
ns, Max
FTCK
Maximum configuration TCK clock frequency
66
MHz, Max
FTCKB
Maximum boundary-scan TCK clock
frequency
66
MHz, Max
相关PDF资料
PDF描述
HMC44DRAN CONN EDGECARD 88POS R/A .100 SLD
XC5VLX110-1FF1153C IC FPGA VIRTEX-5 110K 1153FBGA
HMC44DRAH CONN EDGECARD 88POS R/A .100 SLD
XC4VFX60-11FF672I IC FPGA VIRTEX-4FX 672FFBGA
XC5VSX50T-3FFG1136C IC FPGA VIRTEX-5 50K 1136FBGA
相关代理商/技术参数
参数描述
XC5VLX110-1FF1760I 功能描述:IC FPGA VIRTEX-5 110K 1760FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC5VLX110-1FF676C 功能描述:IC FPGA VIRTEX-5 110K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX110-1FF676CES 制造商:Xilinx 功能描述:
XC5VLX110-1FF676I 功能描述:IC FPGA VIRTEX-5 110K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC5VLX110-1FFG1153C 功能描述:IC FPGA VIRTEX-5 110K 1153FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5