参数资料
型号: XC5VLX30-2FFG324I
厂商: Xilinx Inc
文件页数: 44/91页
文件大小: 0K
描述: IC FPGA VIRTEX-5 30K 324FBGA
标准包装: 1
系列: Virtex®-5 LX
LAB/CLB数: 2400
逻辑元件/单元数: 30720
RAM 位总计: 1179648
输入/输出数: 220
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 324-BBGA,FCBGA
供应商设备封装: 324-FCBGA(19x19)
配用: 568-5088-ND - BOARD DEMO DAC1408D750
HW-AFX-FF324-500-G-ND - BOARD DEV VIRTEX 5 FF324
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
Product Specification
49
TDSPCCK_CEMM/TDSPCKC_CEMM
CEM input to M register CLK
0.25
0.18
0.29
0.21
0.36
0.26
ns
TDSPCCK_CEPP/TDSPCKC_CEPP
CEP input to P register CLK
0.56
0.01
0.63
0.01
0.73
0.01
ns
Setup and Hold Times of the RST Pins
TDSPCCK_{RSTAA, RSTBB}/
TDSPCKC_{RSTAA, RSTBB}
{RSTA, RSTB} input to {A, B} register
CLK
0.24
0.23
0.28
0.26
0.33
0.31
ns
TDSPCCK_RSTCC/ TDSPCKC_RSTCC
RSTC input to C register CLK
0.19
0.17
0.21
0.26
0.28
ns
TDSPCCK_RSTMM/ TDSPCKC_RSTMM
RSTM input to M register CLK
0.25
0.18
0.29
0.21
0.36
0.26
ns
TDSPCCK_RSTPP/TDSPCKC_RSTPP
RSTP input to P register CLK
0.56
0.01
0.63
0.01
0.73
0.01
ns
Combinatorial Delays from Input Pins to Output Pins
TDSPDO_{AP, ACRYOUT, BP, BCRYOUT}_M
{A, B} input to {P, CARRYOUT} output
using multiplier
2.78
3.22
3.84
ns
TDSPDO_{AP, ACRYOUT, BP, BCRYOUT}_NM
{A, B} input to {P, CARRYOUT} output
not using multiplier
1.59
1.77
2.22
ns
TDSPDO_{CP, CCRYOUT, CRYINP, CRYINCRYOUT}
{C, CARRYIN} input to
{P, CARRYOUT} output
1.50
1.67
2.08
ns
Combinatorial Delays from Input Pins to Cascading Output Pins
TDSPDO_{AACOUT, BBCOUT}
{A, B} input to
{ACOUT, BCOUT} output
1.00
1.12
1.31
ns
TDSPDO_{APCOUT, ACRYCOUT, AMULTSIGNOUT,
BPCOUT, BCRYCOUT, BMULTSIGNOUT}_M
{A, B} input to {PCOUT,
CARRYCASCOUT, MULTSIGNOUT}
output using multiplier
2.78
3.22
3.84
ns
TDSPDO_{APCOUT, ACRYCOUT, AMULTSIGNOUT,
BPCOUT, BCRYCOUT, BMULTSIGNOUT}_NM
{A, B} input to {PCOUT,
CARRYCASCOUT, MULTSIGNOUT}
output not using multiplier
1.72
1.92
2.42
ns
TDSPDO_{CPCOUT, CCRYCOUT, CMULTSIGNOUT,
CRYINPCOUT, CRYINCRYCOUT,
CRYINMULTSIGNOUT}
{C, CARRYIN} input to {PCOUT,
CARRYCASCOUT, MULTSIGNOUT}
output
1.63
1.82
2.28
ns
Combinatorial Delays from Cascading Input Pins to All Output Pins
TDSPDO_{ACINP, ACINCRYOUT, BCINP,
BCINCRYOUT}_M
{ACIN, BCIN} input to {P, CARRYOUT}
output using multiplier
2.78
3.22
3.84
ns
TDSPDO_{ACINP, ACINCRYOUT, BCINP,
BCINCRYOUT}_NM
{ACIN, BCIN} input to {P, CARRYOUT}
output not using multiplier
1.59
1.77
2.22
ns
TDSPDO_{ACINACOUT, BCINBCOUT}
{ACIN, BCIN} input to {ACOUT, BCOUT}
output
1.00
1.12
1.31
ns
TDSPDO_{ACINPCOUT, ACINCRYCOUT,
ACINMULTSIGNOUT, BCINPCOUT, BCINCRYCOUT,
BCINMULTSIGNOUT}_M
{ACIN, BCIN} input to {PCOUT,
CARRYCASCOUT, MULTSIGNOUT}
output using multiplier
2.78
3.22
3.84
ns
TDSPDO_{ACINPCOUT, ACINCRYCOUT,
ACINMULTSIGNOUT, BCINPCOUT, BCINCRYCOUT,
BCINMULTSIGNOUT}_NM
{ACIN, BCIN} input to {PCOUT,
CARRYCASCOUT, MULTSIGNOUT}
output not using multiplier
1.72
1.92
2.42
ns
TDSPDO_{PCINP, CRYCINP, MULTSIGNINP,
PCINCRYOUT, CRYCINCRYOUT,
MULTSIGNINCRYOUT}
{PCIN, CARRYCASCIN, MULTSIGNIN}
input to {P, CARRYOUT} output
1.30
1.45
1.82
ns
Table 69: DSP48E Switching Characteristics (Cont’d)
Symbol
Description
Speed
Units
-3
-2
-1
相关PDF资料
PDF描述
25AA1024T-I/SM IC EEPROM 1MBIT 20MHZ 8SOIC
24LC1025T-E/SM IC EEPROM 1MBIT 400KHZ 8SOIC
25LC1024T-I/SM IC EEPROM 1MBIT 20MHZ 8SOIC
24LC1025T-E/SN IC EEPROM 1024KB 400KHZ 8SOIC
24LC1026T-E/SN IC EEPROM 1024KB 400KHZ 8SOIC
相关代理商/技术参数
参数描述
XC5VLX30-2FFG676C 功能描述:IC FPGA VIRTEX-5 30K 676FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX30-2FFG676I 功能描述:IC FPGA VIRTEX-5 30K 676FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX30-3FF324C 功能描述:IC FPGA VIRTEX-5 30K 324FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX30-3FF676C 功能描述:IC FPGA VIRTEX-5 30K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX30-3FFG324C 功能描述:IC FPGA VIRTEX-5 30K 324FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5