参数资料
型号: XC5VLX50-2FFG676C
厂商: Xilinx Inc
文件页数: 50/91页
文件大小: 0K
描述: IC FPGA VIRTEX-5 50K 676-FBGA
标准包装: 1
系列: Virtex®-5 LX
LAB/CLB数: 3600
逻辑元件/单元数: 46080
RAM 位总计: 1769472
输入/输出数: 440
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 676-BBGA,FCBGA
供应商设备封装: 676-FCBGA(27x27)
配用: 568-5088-ND - BOARD DEMO DAC1408D750
HW-V5-ML561-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-V5-ML550-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-V5-ML521-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-V5GBE-DK-UNI-G-ND - KIT DEV V5 LXT GIGABIT ETHERNET
122-1508-ND - EVALUATION PLATFORM VIRTEX-5
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
Product Specification
54
Table 73: Regional Clock Switching Characteristics (BUFR)
Symbol
Description
Devices
Speed Grade
Units
-3
-2
-1
TBRCKO_O
Clock to out delay from
I to O
LX20T
N/A
0.79
0.90
ns
LX30, LX30T, LX50, LX50T,
LX85, LX85T, LX110, LX110T,
SX35T, SX50T, FX100T, and
FX130T
0.56
0.59
0.67
ns
FX30T
0.72
0.78
0.86
ns
FX70T
0.69
0.74
0.83
ns
LX155 and LX155T
0.73
0.80
0.90
ns
LX220, LX220T, LX330,
LX330T, SX95T, SX240T,
TX150T, TX240T, and FX200T
N/A
0.59
0.67
ns
TBRCKO_O_BYP
Clock to out delay from I to
O with Divide Bypass
attribute set
LX20T
N/A
0.29
0.30
ns
LX30, LX30T, LX50, LX50T,
LX85, LX85T, LX110, LX110T,
SX35T, SX50T, FX30T, FX70T,
FX100T, and FX130T
0.23
0.24
0.26
ns
LX155 and LX155T
0.24
0.26
0.30
ns
LX220, LX220T, LX330,
LX330T, SX95T, SX240T,
TX150T, TX240T, and FX200T
N/A
0.24
0.26
ns
TBRDO_CLRO
Propagation delay from
CLR to O
All
0.61
0.70
0.82
ns
Maximum Frequency
FMAX
Regional clock tree
(BUFR)
All
300
250
MHz
相关PDF资料
PDF描述
RMC65DRYN-S734 CONN EDGECARD 130PS DIP .100 SLD
RSC65DRYH-S734 CONN EDGECARD 130PS DIP .100 SLD
RMC65DRYH-S734 CONN EDGECARD 130PS DIP .100 SLD
RCB108DHBS CONN EDGECARD 216PS R/A .050 DIP
AMC36DRXI CONN EDGECARD 72POS .100 DIP SLD
相关代理商/技术参数
参数描述
XC5VLX50-2FFG676I 功能描述:IC FPGA VIRTEX-5 50K 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX50-3FF1153C 功能描述:IC FPGA VIRTEX-5 50K 1153FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX50-3FF324C 功能描述:IC FPGA VIRTEX-5 50K 324FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX50-3FF676C 功能描述:IC FPGA VIRTEX-5 50K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX50-3FFG1153C 功能描述:IC FPGA VIRTEX-5 50K 1153FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5