参数资料
型号: XC5VSX50T-2FF1136C
厂商: Xilinx Inc
文件页数: 86/91页
文件大小: 0K
描述: IC FPGA VIRTEX-5 50K 1136FBGA
产品变化通告: Step Intro and Pkg Change 11/March/2008
标准包装: 1
系列: Virtex®-5 SXT
LAB/CLB数: 4080
逻辑元件/单元数: 52224
RAM 位总计: 4866048
输入/输出数: 480
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 1136-BBGA,FCBGA
供应商设备封装: 1136-FCBGA
配用: 568-5088-ND - BOARD DEMO DAC1408D750
122-1796-ND - EVALUATION PLATFORM VIRTEX-5
HW-AFX-FF1136-500-G-ND - BOARD DEV VIRTEX 5 FF1136
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
Product Specification
87
02/02/07
3.0
Added XC5VSX35T, XC5VSX50T, and SX5VSX95T devices to appropriate tables.
Revised the IRPU values in Table 3, page 2.
Revised the ICCAUXQ values in Table 4, page 3.
Added values to Table 5, page 6.
Minor added notes and changed descriptions in Table 25, page 13 and Table 26, page 13.
Revised the SFI-4.1 (SDR LVDS Interface) -1 values in Table 53, page 29.
Revised gain error, bipolar gain error, and event conversion time in Table51, page26
Changed the design software version that matches this data sheet above Table 54 on page 30.
In Switching Characteristics, the following values are revised:
LVCMOS25, Fast, 12 mA in Table 56, page 32.
Setup and Hold and TICKQ in Table 60, page 40.
Sequential delay values in Table 63, page 43.
TCXB, TCEO, and TDICK in Table 65, page 44.
TRCKO_DO, TRCKO_POINTERS, TRCKO_ECCR, TRCKO_ECC, TRCCK_ADDR, TRDCK_DI, TRDCK_DI_ECC,
TRCCK_WREN, and TRCO_FLAGS in Table 68, page 47.
TDSPDCK_CC, TDSPCCK_{RSTAA, RSTBB}, TDSPCKO_{PP, CRYOUTP}, FMAX_MULT_NOMREG and
FMAX_MULT_NOMREG_PATDET in Table 69, page 48.
TBCCKO_O, and TBGCKO_O in Table 71, page 53.
TBUFIOCKO_O and FMAX in Table 72, page 53.
TBRCKO_O and TBRCKO_O_BYP in Table 73, page 54.
Parameters in Table 74, page 55 including notes.
Revised values in Table 84, Table 85, and Table 86.
Clarified description in Table 91, page 69.
Revised values in Table 91, Table 92, and Table 93.
Removed duplicate TBUFR_MAX_FREQ and TBUFIO_MAX_FREQ from Table 98.
Revised values in Table 101, page 85.
Date
Version
Revision
相关PDF资料
PDF描述
XC6VLX130T-2FF1156C IC FPGA VIRTEX 6 128K 1156FFBGA
XC6VLX130T-2FFG1156C IC FPGA VIRTEX 6 128K 1156FFGBGA
XC6VLX130T-L1FFG1156C IC FPGA VIRTEX 6 128K 1156FFGBGA
AMC43DRTN CONN EDGECARD 86POS .100 DIP SLD
AMC43DRTH CONN EDGECARD 86POS .100 DIP SLD
相关代理商/技术参数
参数描述
XC5VSX50T-2FF1136I 功能描述:IC FPGA VIRTEX-5 50K 1136FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 SXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VSX50T-2FF665C 功能描述:IC FPGA VIRTEX-5 50K 665FCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 SXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VSX50T-2FF665CES 制造商:Xilinx 功能描述:
XC5VSX50T-2FF665I 功能描述:IC FPGA VIRTEX-5 50K 665FCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 SXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VSX50T-2FFG1136C 功能描述:IC FPGA VIRTEX-5 50K 1136FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 SXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5