参数资料
| 型号： | XC6SLX100T-2FG900I |
| 厂商： | Xilinx Inc |
| 文件页数： | 12/89页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN 6 900FGGBGA |
| 标准包装： | 27 |
| 系列： | Spartan® 6 LXT |
| LAB/CLB数： | 7911 |
| 逻辑元件/单元数： | 101261 |
| RAM 位总计： | 4939776 |
| 输入/输出数： | 498 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 900-BBGA |
| 供应商设备封装： | 900-FBGA |
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Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.0) October 17, 2011
Product Specification
2
I/O input voltage or voltage
applied to 3-state output,
relative to GND(4)
All user and dedicated
I/Os
Commercial
DC
–0.60 to 4.10
V
20% overshoot duration
–0.75 to 4.25
V
8% overshoot duration(5)
–0.75 to 4.40
V
Industrial
DC
–0.60 to 3.95
V
20% overshoot duration
–0.75 to 4.15
V
4% overshoot duration(5)
–0.75 to 4.40
V
Expanded (Q)
DC
–0.60 to 3.95
V
20% overshoot duration
–0.75 to 4.15
V
4% overshoot duration(5)
–0.75 to 4.40
V
Restricted to
maximum of 100 user
I/Os
Commercial
20% overshoot duration
–0.75 to 4.35
V
15% overshoot duration(5) –0.75 to 4.40
V
10% overshoot duration
–0.75 to 4.45
V
Industrial
20% overshoot duration
–0.75 to 4.25
V
10% overshoot duration
–0.75 to 4.35
V
8% overshoot duration(5)
–0.75 to 4.40
V
Expanded (Q)
20% overshoot duration
–0.75 to 4.25
V
10% overshoot duration
–0.75 to 4.35
V
8% overshoot duration(5)
–0.75 to 4.40
V
TSTG
Storage temperature (ambient)
–65 to 150
°C
TSOL
Maximum soldering temperature(6)
(TQG144, CPG196, CSG225, CSG324, CSG484, and FTG256)
+260
°C
Maximum soldering temperature(6) (Pb-free packages: FGG484, FGG676, and FGG900)
+250
°C
Maximum soldering temperature(6) (Pb packages: CS484, FT256, FG484, FG676, and FG900)
+220
°C
Tj
Maximum junction temperature(6)
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2.
When programming eFUSE, VFS VCCAUX. Requires up to 40 mA current. For read mode, VFS can be between GND and 3.45 V.
3.
I/O absolute maximum limit applied to DC and AC signals. Overshoot duration is the percentage of a data period that the I/O is stressed
beyond 3.45V.
4.
For I/O operation, refer to UG381: Spartan-6 FPGA SelectIO Resources User Guide.
5.
Maximum percent overshoot duration to meet 4.40V maximum.
6.
For soldering guidelines and thermal considerations, see UG385: Spartan-6 FPGA Packaging and Pinout Specification.
Table 1: Absolute Maximum Ratings(1) (Cont’d)
Symbol
Description
Units
相关PDF资料 |
PDF描述 |
|---|---|
| XC6SLX100T-2FGG900I | IC FPGA SPARTAN 6 101K 900FGGBGA |
| SST39SF010A-70-4C-WHE-T | IC FLASH MPF 1MBIT 70NS 32TSOP |
| XC6SLX150-N3FGG900C | IC FPGA SPARTAN-6 900FBGA |
| SST39VF020-70-4C-NHE-T | IC FLASH MPF 2MBIT 70NS 32PLCC |
| 25LC256T-E/SM | IC EEPROM 256KBIT 10MHZ 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC6SLX100T-2FGG484C | 功能描述:IC FPGA SPARTAN 6 101K 484FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX100T-2FGG484I | 功能描述:IC FPGA SPARTAN 6 101K 484FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX100T-2FGG676C | 功能描述:IC FPGA SPARTAN 6 101K 676FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX100T-2FGG676I | 功能描述:IC FPGA SPARTAN 6 101K 676FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX100T-2FGG900C | 功能描述:IC FPGA SPARTAN 6 101K 900FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
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