参数资料
| 型号： | XC6SLX150T-N3FGG900I |
| 厂商： | Xilinx Inc |
| 文件页数： | 2/11页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-6 900FBGA |
| 标准包装： | 27 |
| 系列： | Spartan® 6 LXT |
| LAB/CLB数： | 11519 |
| 逻辑元件/单元数： | 147443 |
| RAM 位总计： | 4939776 |
| 输入/输出数： | 540 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 900-BBGA |
| 供应商设备封装： | 900-FBGA |
Spartan-6 Family Overview
DS160 (v2.0) October 25, 2011
Product Specification
10
Notice of Disclaimer
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maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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03/03/10
1.4
Updated the slice counts for the LX25 and LX25T in Table 1. Revised the Dynamic Reconfiguration
Port section. Added to the Spread-Spectrum Clocking section. Changed the PLL VCO maximum
frequency to 1080 MHz and the DSP48A1 slice maximum frequency to 320 MHz due to the addition
of the -4 speed specification. Clarified configurations in the Programmable Data Width section.
Updated Low-Power Gigabit Transceiver operating rate.
08/02/10
1.5
Updated data transfer rate per differential I/O from 1,050 Mb/s to 1,080 Mb/s in Summary of Spartan-6
FPGA Features. Added the -3N speed grade to appropriate section throughout the document,
section with SPI and BPI interface information. Removed the Dynamic Reconfiguration Port section.
Updated the operating speed of the DSP48A1 slice multiplier and accumulator to 390 MHz in Digital
11/05/10
1.6
In Summary of Spartan-6 FPGA Features and in Low-Power Gigabit Transceiver, updated GTP serial
transceiver data rate to 3.2 Gb/s. Updated the notes in Figure 1. Added
DS170, XA Spartan-6
Automotive FPGA Family Overview to the Spartan-6 FPGA Documentation.
03/21/11
1.7
Updated from Advance to Preliminary Specification. Removed -4 speed grade from Summary of
10/25/11
2.0
Updated from Preliminary Specification to Production Specification. Updated Configuration, including
the range of configuration bits to 3 Mb and 33 Mb, and Input and Output Delay. Updated Spartan-6
(DS172) to list of documentation.
Date
Version
Description of Revisions
相关PDF资料 |
PDF描述 |
|---|---|
| ASC60DREH | CONN EDGECARD 120POS .100 EYELET |
| ACB50DHBT | CONN EDGECARD 100PS R/A .050 DIP |
| XC6SLX150T-2FG900I | IC FPGA SPARTAN 6 900FGGBGA |
| GCB105DHBT | CONN EDGECARD 210PS R/A .050 SLD |
| FMC19DRAN-S734 | CONN EDGECARD 38POS .100 R/A SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC6SLX16-2CPG196C | 功能描述:IC FPGA SPARTAN 6 14K 196CPGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC6SLX16-2CPG196I | 功能描述:IC FPGA SPARTAN 6 14K 196CPGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28） |
| XC6SLX16-2CSG225C | 功能描述:IC FPGA SPARTAN 6 14K 225CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA（23x23） 其它名称:220-1241 |
| XC6SLX16-2CSG225I | 功能描述:IC FPGA SPARTAN 6 14K 225CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC6SLX16-2CSG324C | 功能描述:IC FPGA SPARTAN 6 14K 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA（23x23） 其它名称:220-1241 |
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