参数资料
| 型号： | XC6SLX25-N3CSG324C |
| 厂商： | Xilinx Inc |
| 文件页数： | 11/11页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-6 324CSBGA |
| 标准包装： | 126 |
| 系列： | Spartan® 6 LX |
| LAB/CLB数： | 1879 |
| 逻辑元件/单元数： | 24051 |
| RAM 位总计： | 958464 |
| 输入/输出数： | 226 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 324-LFBGA，CSPBGA |
| 供应商设备封装： | 324-CSPBGA |
Spartan-6 Family Overview
DS160 (v2.0) October 25, 2011
Product Specification
9
Spartan-6 FPGA Ordering Information
Table 3 shows the speed and temperature grades available in the different Spartan-6 devices. Some devices might not be
available in every speed and temperature grade.
The Spartan-6 FPGA ordering information shown in Figure 1 applies to all packages, including Pb-Free. Refer to the
Package Marking section of UG385, Spartan-6 FPGA Packaging and Pinouts for a more detailed explanation of the device
markings.
Revision History
The following table shows the revision history for this document:
Table 3: Speed Grade and Temperature Ranges
Device Family
Speed Grade and Temperature Range
Commercial (C)
0°C to +85°C
Industrial (I)
–40°C to +100°C
Spartan-6 LX
-3, -3N, -2, -1L
Spartan-6 LXT
-3, -3N, -2
X-Ref Target - Figure 1
Figure 1: Spartan-6 FPGA Ordering Information
Date
Version
Description of Revisions
02/02/09
1.0
Initial Xilinx release.
05/05/09
1.1
Updated and simplified Designed for low cost, Multi-voltage, multi-standard SelectIO interface
banks, and Integrated Memory Controller blocks sections on page 1. Clarified PCI support on page 1is
only for the 33 MHz specification. Revised number of logic cells, slices, and maximum user I/O, and
the CSG225 package and the XC6SLX45T in the FGG676 package, added XC6SLX9 in the FT(G)256
package and XC6SLX45 in the CSG324 package, and added notes. Clerical edits to the following
and electrical characteristics in the Input/Output section.
06/24/09
1.2
XC6SLX75T devices. Added ordering information and FPGA documentation sections. Removed
partial reconfiguration discussion from the Readback section.
11/05/09
1.3
Updated Figure 1, page 9 to show -4 speed grade. Added 64-bit PCI support on page 1. Updated User
I/O numbers in Table 1and Table 2. Clarifying edits to these sections: Configuration, Digital Signal
Processing—DSP48A1 Slice, Input/Output, and PCI Express documentation.
Example: XC6SLX100T-2FGG676C
Device Type
Temperature Range:
C = Commercial (Tj = 0°C to +85°C)
I = Industrial (Tj = –40°C to +100°C)
Number of Pins
Package Type
Speed Grade
(-L1(1), -2, -3, -N3(2))
Pb-Free
DS160_01_011311
Note:
1) -L1 is the ordering code for the lower power, -1L speed grade.
Not all devices are offered in this version (LX only).
See the Spartan-6 FPGA data sheet for more information.
2) -N3 is the ordering code for the -3N speed grade,
which indicates the devices in which MCB functionality is not supported.
相关PDF资料 |
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| 93LC86CT-I/MNY | IC EEPROM SER 16K 2.5V 8TDFN |
| XC6SLX25-N3FTG256I | IC FPGA SPARTAN-6 256FBGA |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC6SLX25-N3CSG324I | 功能描述:IC FPGA SPARTAN-6 324CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC6SLX25-N3FG484C | 制造商:Xilinx 功能描述:SPARTAN 6 - Trays 制造商:Xilinx 功能描述:IC FPGA SPARTAN 6 25K 484BGA 制造商:Xilinx 功能描述:IC FPGA 266 I/O 484FBGA |
| XC6SLX25-N3FG484I | 制造商:Xilinx 功能描述:SPARTAN 6 - Trays 制造商:Xilinx 功能描述:IC FPGA SPARTAN 6 25K 484BGA 制造商:Xilinx 功能描述:IC FPGA 266 I/O 484FBGA |
| XC6SLX25-N3FGG484C | 功能描述:IC FPGA SPARTAN-6 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC6SLX25-N3FGG484I | 功能描述:IC FPGA SPARTAN-6 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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