参数资料
型号: XC6SLX4-3CSG225I
厂商: Xilinx Inc
文件页数: 2/11页
文件大小: 0K
描述: IC FPGA SPARTAN 6 3K 225CSGBGA
标准包装: 1
系列: Spartan® 6 LX
LAB/CLB数: 300
逻辑元件/单元数: 3840
RAM 位总计: 221184
输入/输出数: 132
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 225-LFBGA,CSPBGA
供应商设备封装: 225-CSPBGA(13x13)
Spartan-6 Family Overview
DS160 (v2.0) October 25, 2011
Product Specification
10
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03/03/10
1.4
Updated the slice counts for the LX25 and LX25T in Table 1. Revised the Dynamic Reconfiguration
Port section. Added to the Spread-Spectrum Clocking section. Changed the PLL VCO maximum
frequency to 1080 MHz and the DSP48A1 slice maximum frequency to 320 MHz due to the addition
of the -4 speed specification. Clarified configurations in the Programmable Data Width section.
Updated Low-Power Gigabit Transceiver operating rate.
08/02/10
1.5
Updated data transfer rate per differential I/O from 1,050 Mb/s to 1,080 Mb/s in Summary of Spartan-6
FPGA Features. Added the -3N speed grade to appropriate section throughout the document,
including Figure 1. Updated category in Table 2 from Size to Body Size. Updated the Configuration
section with SPI and BPI interface information. Removed the Dynamic Reconfiguration Port section.
Updated the operating speed of the DSP48A1 slice multiplier and accumulator to 390 MHz in Digital
11/05/10
1.6
transceiver data rate to 3.2 Gb/s. Updated the notes in Figure 1. Added
DS170, XA Spartan-6
Automotive FPGA Family Overview to the Spartan-6 FPGA Documentation.
03/21/11
1.7
Updated from Advance to Preliminary Specification. Removed -4 speed grade from Summary of
10/25/11
2.0
Updated from Preliminary Specification to Production Specification. Updated Configuration, including
the range of configuration bits to 3 Mb and 33 Mb, and Input and Output Delay. Updated Spartan-6
(DS172) to list of documentation.
Date
Version
Description of Revisions
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XC6SLX4-3TQG144C 功能描述:IC FPAG SPARTAN 6 3K 144TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC6SLX4-3TQG144I 功能描述:IC FPAG SPARTAN 6 9K 144TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC6SLX45-2CSG324C 功能描述:IC FPGA SPARTAN 6 43K 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
XC6SLX45-2CSG324CES9983 制造商:Xilinx 功能描述:
XC6SLX45-2CSG324I 功能描述:IC FPGA SPARTAN 6 43K 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241