参数资料
| 型号： | XC6SLX9-N3CSG225I |
| 厂商： | Xilinx Inc |
| 文件页数： | 5/11页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-6 225CSBGA |
| 标准包装： | 160 |
| 系列： | Spartan® 6 LX |
| LAB/CLB数： | 715 |
| 逻辑元件/单元数： | 9152 |
| RAM 位总计： | 589824 |
| 输入/输出数： | 160 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 225-LFBGA，CSPBGA |
| 供应商设备封装： | 225-CSPBGA（13x13） |
Spartan-6 Family Overview
DS160 (v2.0) October 25, 2011
Product Specification
3
Spartan-6 FPGA Device-Package Combinations and Available I/Os
Spartan-6 FPGA package combinations with the available I/Os and GTP transceivers per package are shown in Table 2.
Due to the transceivers, the LX and LXT pinouts are not compatible.
Configuration
Spartan-6 FPGAs store the customized configuration data in SRAM-type internal latches. The number of configuration bits
is between 3 Mb and 33 Mb depending on device size and user-design implementation options. The configuration storage
is volatile and must be reloaded whenever the FPGA is powered up. This storage can also be reloaded at any time by pulling
the PROGRAM_B pin Low. Several methods and data formats for loading configuration are available.
Bit-serial configurations can be either master serial mode, where the FPGA generates the configuration clock (CCLK) signal,
or slave serial mode, where the external configuration data source also clocks the FPGA. For byte-wide configurations,
master SelectMAP mode generates the CCLK signal while slave SelectMAP mode receives the CCLK signal for the 8- and
16-bit-wide transfer. In master serial mode, the beginning of the bitstream can optionally switch the clocking source to an
external clock, which can be faster or more precise than the internal clock. The available JTAG pins use boundary-scan
protocols to load bit-serial configuration data.
Table 2: Spartan-6 Device-Package Combinations and Maximum Available I/Os
Package
CPG196(1)
TQG144(1)
CSG225(2)
FT(G)256(3)
CSG324
FG(G)484(3,4)
CSG484(4)
FG(G)676(3)
FG(G)900(3)
Body Size
(mm)
8x 8
20x20
13x13
17x17
15x15
23x23
19x19
27x 27
31x31
Pitch (mm)
0.5
0.8
1.0
0.8
1.0
0.8
1.0
Device
User I/O
GTPs
User
I/O
GTPs
User
I/O
GTPs
User
I/O
GTPs
User
I/O
GTPs
User
I/O
XC6SLX4
106
102
132
XC6SLX9
106
102
160
186
NA
200
XC6SLX16
106
160
186
NA
232
XC6SLX25
186
NA
226
NA
266
XC6SLX45
NA
218
NA
316
NA
320
NA
358
XC6SLX75
NA
280
NA
328
NA
408
XC6SLX100
NA
326
NA
338
NA
480
XC6SLX150
NA
338
NA
338
NA
498
NA
576
XC6SLX25T
2
190
2
250
XC6SLX45T
4
190
4
296
4
296
XC6SLX75T
4
268
4
292
8
348
XC6SLX100T
4
296
4
296
8
376
8
498
XC6SLX150T
4
296
4
296
8
396
8
540
Notes:
1.
There is no memory controller on the devices in these packages.
2.
Memory controller block support is x8 on the XC6SLX9 and XC6SLX16 devices in the CSG225 package. There is no memory controller in the
XC6SLX4.
3.
These devices are available in both Pb and Pb-free (additional G) packages as standard ordering options.
4.
These packages support two of the four memory controllers in the XC6SLX75, XC6SLX75T, XC6SLX100, XC6SLX100T, XC6SLX150, and
XC6SLX150T devices.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC6SLX9-N3CSG324C | 功能描述:IC FPGA SPARTAN-6 324CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC6SLX9-N3CSG324I | 功能描述:IC FPGA SPARTAN-6 324CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC6SLX9-N3FT256C | 制造商:Xilinx 功能描述:IC FPGA SPARTAN-6 9K 256BGA 制造商:Xilinx 功能描述:IC FPGA 186 I/O 256FTBGA |
| XC6SLX9-N3FT256I | 制造商:Xilinx 功能描述:IC FPGA SPARTAN-6 9K 256BGA |
| XC6SLX9-N3FTG256C | 功能描述:IC FPGA SPARTAN-6 256PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LX 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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