参数资料
| 型号： | XC6VLX365T-L1FF1759I |
| 厂商： | Xilinx Inc |
| 文件页数： | 1/11页 |
| 文件大小： | 0K |
| 描述： | IC FPGA VIRTEX-6LXT 1759FFBGA |
| 产品培训模块： | Virtex-6 FPGA Overview |
| 产品变化通告： | Virtex-6 FIFO Input Logic Reset 18/Apr/2011 |
| 标准包装： | 12 |
| 系列： | Virtex® 6 LXT |
| LAB/CLB数： | 28440 |
| 逻辑元件/单元数： | 364032 |
| RAM 位总计： | 15335424 |
| 输入/输出数： | 720 |
| 电源电压： | 0.91 V ~ 0.97 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 1759-BBGA，FCBGA |
| 供应商设备封装： | 1759-FCBGA |
DS150 (v2.4) January 19, 2012
Product Specification
1
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and other countries.. PCI, PCIe and PCI Express are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
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General Description
The Virtex-6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon
foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on
innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-
based architecture, the Virtex-6 family contains multiple distinct sub-families. This overview covers the devices in the LXT, SXT, and HXT
sub-families. Each sub-family contains a different ratio of features to most efficiently address the needs of a wide variety of advanced logic
designs. In addition to the high-performance logic fabric, Virtex-6 FPGAs contain many built-in system-level blocks. These features allow
logic designers to build the highest levels of performance and functionality into their FPGA-based systems. Built on a 40 nm state-of-the-
art copper process technology, Virtex-6 FPGAs are a programmable alternative to custom ASIC technology. Virtex-6 FPGAs offer the best
solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance
embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
Summary of Virtex-6 FPGA Features
Three sub-families:
Virtex-6 LXT FPGAs: High-performance logic with
advanced serial connectivity
Virtex-6 SXT FPGAs: Highest signal processing
capability with advanced serial connectivity
Virtex-6 HXT FPGAs: Highest bandwidth serial
connectivity
Compatibility across sub-families
LXT and SXT devices are footprint compatible in
the same package
Advanced, high-performance FPGA Logic
Real 6-input look-up table (LUT) technology
Dual LUT5 (5-input LUT) option
LUT/dual flip-flop pair for applications requiring rich
register mix
Improved routing efficiency
64-bit (or two 32-bit) distributed LUT RAM option
per 6-input LUT
SRL32/dual SRL16 with registered outputs option
Powerful mixed-mode clock managers (MMCM)
MMCM blocks provide zero-delay buffering,
frequency synthesis, clock-phase shifting, input-
jitter filtering, and phase-matched clock division
36-Kb block RAM/FIFOs
Dual-port RAM blocks
Programmable
-
Dual-port widths up to 36 bits
-
Simple dual-port widths up to 72 bits
Enhanced programmable FIFO logic
Built-in optional error-correction circuitry
Optionally use each block as two independent
18 Kb blocks
High-performance parallel SelectIO technology
1.2 to 2.5V I/O operation
Source-synchronous interfacing using
ChipSync technology
Digitally controlled impedance (DCI) active
termination
Flexible fine-grained I/O banking
High-speed memory interface support with
integrated write-leveling capability
Advanced DSP48E1 slices
25 x 18, two's complement multiplier/accumulator
Optional pipelining
New optional pre-adder to assist filtering
applications
Optional bitwise logic functionality
Dedicated cascade connections
Flexible configuration options
SPI and Parallel Flash interface
Multi-bitstream support with dedicated fallback
reconfiguration logic
Automatic bus width detection
System Monitor capability on all devices
On-chip/off-chip thermal and supply voltage
monitoring
JTAG access to all monitored quantities
Integrated interface blocks for PCI Express designs
Compliant to the PCI Express Base Specification
2.0
Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with
GTX transceivers
Endpoint and Root Port capable
x1, x2, x4, or x8 lane support per block
GTX transceivers: up to 6.6 Gb/s
Data rates below 480 Mb/s supported by
oversampling in FPGA logic.
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
Integrated 10/100/1000 Mb/s Ethernet MAC block
Supports 1000BASE-X PCS/PMA and SGMII
using GTX transceivers
Supports MII, GMII, and RGMII using SelectIO
technology resources
2500Mb/s support available
40 nm copper CMOS process technology
1.0V core voltage (-1, -2, -3 speed grades only)
Lower-power 0.9V core voltage option (-1L speed
grade only)
High signal-integrity flip-chip packaging available in
standard or Pb-free package options
11
Virtex-6 Family Overview
DS150 (v2.4) January 19, 2012
Product Specification
相关PDF资料 |
PDF描述 |
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| AMC43DREI-S13 | CONN EDGECARD 86POS .100 EXTEND |
| XC6VLX365T-3FFG1759C | IC FPGA VIRTEX 6 364K 1759FFGBGA |
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| RSC65DRAH | CONN EDGECARD 130PS R/A .100 SLD |
| RMC65DRAH | CONN EDGECARD 130PS R/A .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC6VLX365T-L1FFG1156C | 功能描述:IC FPGA VIRTEX 6 364K 1156FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| XC6VLX365T-L1FFG1156I | 功能描述:IC FPGA VIRTEX 6 364K 1156FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| XC6VLX365T-L1FFG1759C | 功能描述:IC FPGA VIRTEX 6 364K 1759FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| XC6VLX365T-L1FFG1759I | 功能描述:IC FPGA VIRTEX 6 364K 1759FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| XC6VLX550T | 制造商:XILINX 制造商全称:XILINX 功能描述:Virtex-6 FPGA Data Sheet: DC and Switching Characteristics |
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