参数资料
型号: XCL202B331BR-G
厂商: Torex Semiconductor Ltd
文件页数: 12/21页
文件大小: 0K
描述: IC STEP DOWN DC/DC 3.3V CL2025
标准包装: 1
系列: XCL202
类型: 非隔离(POL)
输出数: 1
电压 - 输入(最小): 2V
电压 - 输入(最大): 6V
Voltage - Output 1: 3.3V
电流 - 输出(最大): 400mA
特点: 具有远程开/关功能和 UVLO
安装类型: 表面贴装
封装/外壳: 1008(2520 公制)
尺寸/尺寸: 0.10" L x 0.08" W x 0.04" H(2.5mm x 2.0mm x 1.04mm)
包装: 标准包装
工作温度: -40°C ~ 85°C
效率: 92%
其它名称: 893-1173-6
XCL201/XCL202 Series
■ NOTE ON USE (Continued)
14. In order to stabilize V IN voltage level and oscillation frequency, we recommend that a by-pass capacitor (C IN ) be connected as close as
possible to the V IN & V SS pins.
15. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode.
16. When PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for the range of MAXDUTY area
with small input/output differential.
17. Please use within the power dissipation range below.
power dissipation figure shown is PCB mounted.
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Please also note that the power dissipation may changed by test conditions, the
0
25
50
75
100
Operating Temperature  Ta (℃)
the power loss of micro DC/DC according to the following formula:
power loss = V OUT × I OUT × ((100/EFFI) – 1)
(W)
V OUT : Output Voltage (V)
I OUT : Output Current (A)
EFFI: Conversion Efficiency (%)
40.0
Measurement Condition (Reference data)
Dimensions 40 x 40 mm (1600 mm in one side)
Condition:
Ambient:
Soldering:
Board:
Material:
Thickness:
Through-hole:
Mount on a board
Natural convection
Lead (Pb) free
2
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Glass Epoxy (FR-4)
1.6mm
4 x 0.8 Diameter
28.9
.
2.54
.
1.4
Evaluation Board (unit: mm)
12/21
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