参数资料
型号: XF2G-1614-11
厂商: Omron Electronics Inc-EMC Div
文件页数: 1/4页
文件大小: 0K
描述: CONN FPC 16POS 0.5MM SMT
标准包装: 1
系列: XF2G
连接器类型: 垂直触点,单面
位置数: 16
间距: 0.020"(0.50mm)
FFC,FCB 厚度: 0.30mm
板上方高度: 0.163"(4.15mm)
安装类型: 表面贴装
线缆端类型: 锥形
端子: 焊接
包装: 剪切带 (CT)
触点表面涂层:
触点涂层厚度: 79µin(2.00µm)
工作温度: -30°C ~ 85°C
额定电流: 0.500A
额定电压: 50V
体座材料: 聚酰胺(PA46),尼龙 4/6
其它名称: OR674CT
Non-ZIF Type (0.5 mm-pitch)
XF2G
Top-entry ZIF Connector
? Low on-board profile of only 4.15 mm.
? Adhesion face on top of the connector suits automatic
mounting.
? Applicable FPC thickness, t = 0.3 mm.
? RoHS Compliant.
Ordering Information
Pins (Note 1)
6
14
16
24
26
Quantity per reel (Note 2)
1,000
Model
XF2G-0614-11
XF2G-1414-11
XF2G-1614-11
XF2G-2414-11
XF2G-2614-11
Note: 1. Consult your OMRON representative for enquiries related to pin-number specifications.
2. Order an integer multiple of the quantity per reel.
Specifications
Rated current
Rated voltage
Contact resistance
Insulation resistance
Withstand voltage
Insertion tolerance
0.5A AC/DC
50V AC/DC
30 m ? max. (at 20 mV max., 100 mA max.)
100 M ? min. (at 250 V DC)
250V AC for 1 min. (leakage current: 1 mA max.)
10 times
Ambient operating temperature -30 to +85°C (with no icing or condensation)
■ Materials/Finish
Housing
Contact
PA46 resin (UL94V-0)/natural
Spring copper alloy/nickel substrate (2 μ m), tin-alloy plating (2 μ m)
Non-ZIF Type (0.5 mm-pitch)
XF2G
1
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