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参数资料
| 型号： | XF2J-1024-11 |
| 厂商： | Omron Electronics Inc-EMC Div |
| 文件页数： | 21/28页 |
| 文件大小： | 0K |
| 描述： | CONN FPC 10POS 0.5MM SMT |
| 标准包装： | 1 |
| 系列： | XF2J |
| 连接器类型： | 垂直触点，单面 |
| 位置数： | 10 |
| 间距： | 0.020"（0.50mm） |
| FFC，FCB 厚度： | 0.30mm |
| 板上方高度： | 0.163"（4.15mm） |
| 安装类型： | 表面贴装 |
| 线缆端类型： | 锥形 |
| 端子： | 焊接 |
| 锁定功能： | 滑锁 |
| 特点： | 零插入力（ZIF） |
| 包装： | 剪切带 (CT) |
| 触点表面涂层： | 锡合金 |
| 触点涂层厚度： | 79µin（2.00µm） |
| 工作温度： | -30°C ~ 85°C |
| 额定电流： | 0.500A |
| 额定电压： | 50V |
| 体座材料： | 聚酰胺（PA46），尼龙 4/6 |
| 其它名称： | OR661CT |
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XF
Common Precautions for XF Connectors
XF
■ Safety Precautions
Precautions for Correct Use
● All Models
Operating
? Make sure that the FPC has been inserted correctly and
not backward.
Inserting the FPC incorrectly with the FPC connecting face
not aligned with the customer's design specifications may
damage the contacts and equipment may malfunction.
? Insert the FPC fully to the back of the connector. Failing to
do so may result in a loss of contact reliability.
? When inserting and removing the FPC, applying pressure
from above or below, left to right or at an angle may cause
the FPC contacts to become damaged or detached and
may result in contact failure.
Designing
? Gently pull out the FPC taking care not to apply force
directly to the connector.
Bending the FPC in the area where it enters the connector
or applying force to the FPC itself may result in contact fail-
ure.
? When installing the FPC at a location or on equipment that
will subject the FPC to repeated vibration or movement,
secure the FPC prior to use.
? Use FPCs that conform to the appropriate specifications
Board Mounting Precautions
flatness
? Be careful of board warping. The connector ?atness is 0.1
0.1 A A large of may may
mm max. max. large amount of warping, however, result
in faults.
result soldering soldering faults.
? ? Do not apply excessive force on the connector before
mounting it. The connector may be damaged, resulting in
faulty contacts. Do not insert the FPC and lock the slider
before mounting the connector.
Be careful to apply an force on the load on the
? Avoid applying not excessive excessive board when board
when the the actions:”
performing performing following following actions.
1.
2.
1. Dividing multi-cavity boards.
2. Securing a board with with screws.
Storage
1. Do not store the connectors in locations subject to dust or
high humidity.
2. Do not store the connectors in locations close to sources
of gasses such ammonia gas or sulfide gas.
and size as stated by OMRON.
When using a different FPC, or an F/F, contact OMRON.
? Use the same metal for the FPC plating and the connector
plating.
? “Whiskers” may protrude from the FPC film of some lead-
free FPCs. Be careful when using these units.
? Ensure a metal mask thickness of t = 0.12 to 0.15 mm.
The recommended metal mask open area is 90% of the
printed circuit board mating dimensions given in the dimen-
sions diagrams.
Mounting
? Do not perform mounting (reflow or manual soldering) with
the FPC inserted in the connector. Doing so may result in
contact failure.
? The reflow conditions are as stated in OMRON’s specifica-
tions and guidelines. These conditions, however, depend
on the type of solder, the manufacturer, the amount of sol-
der, the size of the circuit board, and the other mounting
materials. Confirm the mounting conditions before using
the connectors.
? When mounting the connector by manual soldering,
observe the following precautions to ensure contact reli-
ability.
Do not
Do not will an the flux rise.
Do not will apply the the ?ux to iron
Do not apply the Doing so to the the connectors
1. Conditions for manual soldering: 350±10°C C for 3±1 s
2. seconds apply an excessive amount of solder. Excessive
2. solder apply cause excessive amount of solder. Excessive
3. solder cause soldering rise. to the mount attach-
3. ments using force. soldering iron may cause mount attachments
to force. Doing
using change shape. so may cause the connectors to
Do not apply
Do other the the mount to any parts of the
cause the other than to mount shape.
4. change shape. the soldering iron to any parts of the con-
4. nector apply than soldering iron attachments. Doing so may
connector connector the change attachments. Doing so
may cause the connector to change shape.
21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XF2J102411A | 制造商:Omron Electronic Components LLC 功能描述:CONN FPC CONN SKT 10 POS 1MM SLDR ST SMD - Bulk 制造商:Omron Electronic Components LLC 功能描述:CONN FPC 10POS 0.5MM PITCH SMD |
| XF2J-1024-11A | 功能描述:FFC & FPC连接器 .5mm SlideLock 10Pin ZIF Single Adhesive RoHS:否 制造商:JAE Electronics 产品类型:Plugs 系列:HD 节距:0.5 mm 位置/触点数量:40 安装角: 安装风格:Cable 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:100 V per contact 电流额定值:0.24 A to 1 A |
| XF2J102411AR100 | 制造商:Omron Electronic Components LLC 功能描述:CONN FPC CONN SKT 10 POS 1MM SLDR ST SMD - Bulk 制造商:Omron Electronic Components LLC 功能描述:CONNECTOR FPC 10POS 0.5MM SMD 制造商:Omron Electronic Components LLC 功能描述:CONNECTOR FPC STANDARD 0.5M |
| XF2J-1024-11A-R100 | 功能描述:FFC & FPC连接器 .5mm SlideLock 10Pin ZIF Single Adhesive RoHS:否 制造商:JAE Electronics 产品类型:Plugs 系列:HD 节距:0.5 mm 位置/触点数量:40 安装角: 安装风格:Cable 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:100 V per contact 电流额定值:0.24 A to 1 A |
| XF2J102412A | 制造商:Omron Electronic Components LLC 功能描述:FPC CONNECTOR - Bulk 制造商:Omron Electronic Components LLC 功能描述:CONN FPC 10POS 0.5MM SMT |
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